Selection of glass, anodic bonding conditions and material compatibility for silicon-glass capacitive sensors

Rogers, Tony; Kowal, Jan

doi:10.1016/0924-4247(94)00872-f

Cited by 169 publications

(76 citation statements)

References 16 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The field assisted bond was initially developed for the bonding of metal to glass, and subsequently the metal was replaced by silicon [1], [51]- [58]. The anodic bonding process is shown schematically in Fig.…”

Section: Anodic Bondingmentioning

confidence: 99%

Wafer-to-wafer bonding for microstructure formation

1998

View full text Add to dashboard Cite

Section: Anodic Bondingmentioning

confidence: 99%

Wafer-to-wafer bonding for microstructure formation

1998

View full text Add to dashboard Cite

“…Factors such as bonding area and bonding environment can also play some roles. A lot of research work has been done to investigate the effects of bonding parameters on the final strength (Nese and Hanneborg, 1993;Rogers and Kowal, 1995;Cozma and Puers, 1995;Cozma et al, 1998;Go and Cho, 1999;Lee et al, 2000;Dunn et al, 2000;Huang and Yang, 2002;Wei et al, 2003). The bond strength generally increases with the increase in applied voltage and temperature.…”

Section: Anodic Bonding Processmentioning

confidence: 99%

Numerical Simulation and Experiments of Fatigue Crack Growth in Multi-Layer Structures of MEMS and Microelectronic Devices

Siegmund¹

2006

View full text Add to dashboard Cite

Public reporting burden for this collection of information is estimated to average 1 hour per response, including the time for reviewing instructions, searching data sources, gathering and maintaining the data needed, and completing and reviewing the collection of information. Send comments regarding this burden estimate or any other aspect of this collection of information, including suggestions for reducing this burden to Washington Headquarters Service, Directorate for Information Operations and Reports, 1215 Jefferson Davis Highway, Suite 1204, Arlington, VA 22202-4302, and Numerical studies predict that increased constraint and smaller size will accelerate fatigue failure due to changes in plastic deformation. Strain gradients significantly affect the process. Measurements of toughness and fatigue crack growth resistance for the model material system are reported. New test protocols for the commonly used 4 point bend delamination test are developed such that both cracks can be propagated and the number of test data obtained is doubled. The novel approach is also essential for fatigue crack growth. While crack growth resistance was rather independent of the thickness of and fatigue crack growth rates were found to be dependent of film thickness. The dependence of the failure behavior on film thickness arises primarily due to enhanced crack path deflection for decreasing film thickness. Material separation in fracture and fatigue is characterized through a cohesive zone law. The model captures the Paris-law type response obtained in experiments, and also predicts that for thinner films the tendency to crack. Damage tolerant design requires accurate data on residual strength and fatigue crack growth resistance. Both quantities, however, depend on constraint and size of the structure considered. While this has been accounted for in residual strength analysis in the past, the present work provides enabling technologies to solve this problem for fatigue. With the conventional approach to fatigue crack growth, the transferability of data from lab to field, or between specimens and structures is not ensured. Thus, coefficients in the Paris law need to be determined experimentally for each level of constraint or each size of interest. It is, however, not ensured that even a large set of experiments will be able to capture all possible load scenarios. The cohesive zone model approach is provided here as alternative. Once cohesive zone parameters are determined, the dependence of fatigue crack growth on constraint and size emerges as the natural outcome of the analysis without the need to further model modifications. 3

show abstract

“…91 The necessary bonding conditions depend on the glass material used. For Corning 7740, the optimal conditions are 305-350 C and 500 V for 15 min (Ref.…”

Section: Anodic Bondingmentioning

confidence: 99%

A practical guide for the fabrication of microfluidic devices using glass and silicon

Iliescu¹,

Taylor²,

Avram³

et al. 2012

Biomicrofluidics

302

207

View full text Add to dashboard Cite

This paper describes the main protocols that are used for fabricating microfluidic devices from glass and silicon. Methods for micropatterning glass and silicon are surveyed, and their limitations are discussed. Bonding methods that can be used for joining these materials are summarized and key process parameters are indicated. The paper also outlines techniques for forming electrical connections between microfluidic devices and external circuits. A framework is proposed for the synthesis of a complete glass/silicon device fabrication flow. I. WHY USE SILICON AND GLASS IN MICRO-AND NANO-FLUIDIC APPLICATIONS?Micro-and nano-fluidic technology continues to be embraced by biologists, 1-3 chemists, 4 and engineers throughout academia and industry. As its applications have expanded, there has been an explosion in the range of materials and processes used to fabricate these devices. The earliest microfluidic devices (e.g., gas 5 and liquid 6 chromatography devices) were made from silicon and glass and borrowed processes directly from semiconductor and microelectromechanical systems (MEMS) manufacturing. 7 Now, however, many researchers have moved away from silicon and glass, and instead use cast elastomers such as polydimethylsiloxane (PDMS)-which is ideal for swift prototyping-or thermoplastic polymers, which can be hot-embossed or injection-molded and are well suited to inexpensive manufacturing. Yet, there remain many applications where glass and silicon offer advantages over polymeric materials. In this paper, we highlight these advantages and offer a framework for selecting fabrication processes when using silicon and glass. A. The dominance of soft lithographyOver the last decade, PDMS has become virtually the default material for forming microfluidic devices, 8 because of the sheer ease with which it can be cast on to a micro-scale mould and then strongly bonded to glass. 9 The elastomeric nature of the material has been exploited to integrate fluidic valves and pumps on-chip and has simplified the production of multi-layer devices because the soft layers readily conform to each other. 10,11 Yet, the low stiffness (usually <1 MPa) of PDMS relative to amorphous thermoplastics, silicon, and glass has its own a) Authors to whom correspondence should be addressed. Electronic addresses: ciliescu@ibn.a-star.edu.sg and hkt@ntu.edu.sg. 6, 016505 (2012) drawbacks. High aspect-ratio channels are notoriously difficult to fabricate in PDMS because of their propensity to collapse. 12 Moreover, difficulties in automating the handling of such a soft material have hampered efforts to scale up PDMS device manufacturing. Meanwhile, PDMS's high oxygen and water permeabilities have proved both a blessing and a curse in different applications.The hydrophobic nature of PDMS can be an important consideration for some biological applications. In drug screening applications, for example, hydrophobic drugs as well as metabolites (urea or albumin) can be absorbed into the device's material due to hydrophobic--hydrophobic interaction...

show abstract

Selection of glass, anodic bonding conditions and material compatibility for silicon-glass capacitive sensors

Cited by 169 publications

References 16 publications

Wafer-to-wafer bonding for microstructure formation

Wafer-to-wafer bonding for microstructure formation

Numerical Simulation and Experiments of Fatigue Crack Growth in Multi-Layer Structures of MEMS and Microelectronic Devices

A practical guide for the fabrication of microfluidic devices using glass and silicon

Contact Info

Product

Resources

About