Abstract:System-On-Package (SOP) can reduce package size, increase functionality and improve performance at lower costs by embedding passives in a multilayered high-density wiring (HDW) structure. Due to the stringent warpage requirement for processing such a package, new base substrate materials are being explored with high modulus. The substrate will also have a Coefficient of Thermal Expansion (CTE) that is close to that of the die. The matched CTE will facilitate no-underfill attach Flip-Chips on SOP substrates. On… Show more
Set email alert for when this publication receives citations?
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.