Segmentation method based modeling and analysis of a glass package power distribution network (PDN)

Abstract

In this paper, for the first time, an accurate glass package power distribution network (PDN) model is proposed for the PDN impedance estimation based on a segmentation method. To verify the proposed modeling method, glass package test vehicles including the PDN are fabricated. Estimated impedance of the glass package PDN based on proposed model is validated by comparing measured and simulated glass package PDN in the frequency domain up to 20 GHz. Estimated impedance based on proposed modeling method showed good correlation with measurement and 3-Dimensional electromagnetic (3D-EM) simulation. Compared to 3D-EM simulation, the proposed method is fast but accurate. Due to low loss of the glass package substrate, sharp PDN impedance peaks at mode resonance frequencies are generated. Signal and power integrity degradation at these frequencies are analyzed. Using the proposed modeling method, locations and frequencies where signal TGVs are less affected by the PDN mode resonances can be efficiently estimated for early stage package PDN design and signal TGV floor plan.

A Statistical Approach for Signal and Power Integrity Co-Design in High-Speed Interconnects Considering Non-Linear Power/Ground Noise and Bit-Patterns

“…To accurately reflect the ground noise, the PDN must be decomposed into the power and ground interconnects instead of the S-parameter model. If the PDN is modeled based on the S-parameter model, such as the touchstone file, ground noise will be added to the power noise, which results in exaggerated power noise and suppressed ground noise [ 22 , 23 , 24 ]. However, high-speed interconnects can be modeled using S-parameter models or equivalent circuit models.…”