2013
DOI: 10.1021/nl400705b
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Seebeck Coefficient of Nanowires Interconnected into Large Area Networks

Abstract: We measured the macroscopic Seebeck coefficient of silicon nanowires (SiNWs), organized in a highly interconnected networks on large areas (order of mm(2)). The fabricated networks are very reliable with respect to random nanowire failure and are electrically and thermally equivalent to many SiNWs placed in parallel between the electrical contacts. The equivalent SiNWs have a macroscopic length of the order of millimeters and are very narrow (width smaller than 100 nm) so that they can be used to exploit therm… Show more

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Cited by 29 publications
(21 citation statements)
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“…Due to the experimental difficulty to fabricate NWNWs with controlled hierarchical assembly and geometry, experimental data on the influence of wire interconnects on the transport properties are still scarce. [ 4,8,33,34 ]…”
Section: Introductionmentioning
confidence: 99%
“…Due to the experimental difficulty to fabricate NWNWs with controlled hierarchical assembly and geometry, experimental data on the influence of wire interconnects on the transport properties are still scarce. [ 4,8,33,34 ]…”
Section: Introductionmentioning
confidence: 99%
“…The resistance of the net shows also a low sensitivity with respect to the non-uniformity (dispersion) of the nanowire width. The Seebeck coefficient of nanowire networks has been measured [101], and its value resulted in a good agreement with the doping, found by measuring the nanowire electrical conductivity. However, the measured doping concentration was slightly higher than the original doping concentration of the silicon top layer.…”
Section: Reviewmentioning
confidence: 81%
“…11. It is easy to demonstrate [100101] that these very large area arrays of very narrow, micrometers long, silicon nanowires are equivalent to the parallel arrangement of very narrow SiNWs with a total length of several millimeters (see the top right sketch of Fig. 11).…”
Section: Reviewmentioning
confidence: 99%
“…A possible alternative approach is to define the nanostructures/nanowires by lithography and etching [ 64 , 65 ] (top down approach), using a suitable design to connect silicon platforms, which can be fabricated simultaneously with the nanostructures. The main advantage of this strategy is the high flexibility in the design of the device: nanostructures can be fabricated and positioned in precise positions and configurations.…”
Section: Techniques For All-silicon Thermoelectric Devicesmentioning
confidence: 99%