2012
DOI: 10.1088/1674-4926/33/1/014008
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SEE characteristics of small feature size devices by using laser backside testing

Abstract: This paper presents single event upset (SEU) and single event latch-up (SEL) characteristics of small feature size devices by laser backside testing method, which is dedicated to dealing with the increasing metal layers on the front side of integrated circuits. The influence of test data pattern on SEU threshold and cross-section is investigated. The supply current state of micro latch-up for deep sub-micron SRAM is described. The laser energy thresholds were correlated to heavy ion thresholds LET to determine… Show more

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Cited by 3 publications
(2 citation statements)
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“…The technical specifications of the PPLSEE-1 are shown in Table 1. PPLSEE-1 achieves precise positioning of SEFI-sensitive areas through controlling the movement of the Device Under Test (DUT) through a highprecision three-dimensional moving platform [20][21][22]. We have developed a testing system for investigating the SEFI of ADCs, which is illustrated in Figure 1.…”
Section: Methodsmentioning
confidence: 99%
“…The technical specifications of the PPLSEE-1 are shown in Table 1. PPLSEE-1 achieves precise positioning of SEFI-sensitive areas through controlling the movement of the Device Under Test (DUT) through a highprecision three-dimensional moving platform [20][21][22]. We have developed a testing system for investigating the SEFI of ADCs, which is illustrated in Figure 1.…”
Section: Methodsmentioning
confidence: 99%
“…Figure 4 shows a schematic diagram of the pulsed laser unit. The laser setup consists of the component laser generator, the optical path system, the 3D mobile table, the synchronization control system and the host computer [40][41][42]. Table 1 shows the main parameters of the laser equipment.…”
Section: Experimental Setup and Devices Selectionmentioning
confidence: 99%