Weak
layers in bamboo, which are prone to the generation of cracks
or are the preferred routes for crack growth, govern the machining
processes and applications of bamboo. Weak layers are avoided during
storing but are utilized during splitting and slicing. Gaining an
understanding of the weak layers is a priority that will allow for
the determination of whether to avoid or utilize them. In this study,
scanning electron microscopy was used to observe the weak layers at
the cellular and subcellular levels. A nanoindentation instrument
and a Raman microscope were used to quantitatively characterize the
mechanical properties and chemical components of these weak layers.
The results show that among the three types of bamboo cells, vessel
cells were the most vulnerable to damage, while fiber cells were the
least susceptible to damage. The weak layers at the subcellular level
were compound middle lamella (CML), thin layers of cell walls, and
pits. The average storage modulus values were as follows: 13.7 GPa
for CML, 17.0 GPa for pits, 20.6 GPa for thin layers, and 25.3 GPa
for thick layers. Compared with the thick layers, the maximum decrement
of cellulose content was 51% in CML and 41% in thin layers. With the
lowest cellulose content, CML was the likeliest subcellular structure
in which cracks propagated. The hardness of the pits was lower than
that of the adjacent non-pit areas. The mechanical properties of bamboo
increased by targeted modification of the weak layers. This work demonstrates
a comprehensive investigation into weak layers of bamboo and quantitatively
visualizes their mechanical and chemical properties.