Seamless modulus gradient structures for highly resilient, stretchable system integration

Wu, Zhigang; Zhang, Shuo; Vorobyev, Alexey; Gamstedt, E. Kristofer; Wu, Kang; Guo, Chuan Fei; Jeong, Seung Hee

doi:10.1016/j.mtphys.2018.02.002

Cited by 35 publications

(40 citation statements)

References 32 publications

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“…By sequentially arranging the high modulus region and the low modulus region through selective crosslinking or composite formation, the strain could be concentrated only in the desired regions. [151,152] The "rigid islands" structure makes possible to integrate the conventional rigid electronic components, free from the strain. Especially, the development of stretchable printed interconnects made possible the active electronic elements located on rigid polymer islands to be successfully incorporated in stretchable devices.…”

Section: Strain Engineering In Double-layer Interfacesmentioning

confidence: 99%

“…The buckling and rigid islands approaches can be readily applied to low-resolution devices. [142][143][144][145][146][147][148][149][150][151][152][153][154][155][156][157][158][159][160][161] On the other hand, the intrinsically stretchable device approach may provide high integration, but the stretchable functional materials are still far behind their practicality. Therefore, there is a need for a new approach that can overcome simultaneously the issues of the high-resolution integration and the lack of materials.…”

Section: Perspectives and Challengesmentioning

confidence: 99%

“…Introducing buckling, islands, or high relief structures into the interfaces could adjust the strain applied to the two different layers. [ 142–161 ] The adhesion between the two layers was increased by introducing microstructured surfaces at the interfaces, [ 142–166 ] such as interlocking metal nanopiles, [ 162 ] hydrogels, [ 164 ] and SBS block copolymers. [ 165,166 ] Interfacial adhesion between the multiple device components is an important issue for integrated stretchable devices.…”

Section: Design Of Mesoscale Interfacesmentioning

confidence: 99%

See 2 more Smart Citations

Interface Design for Stretchable Electronic Devices

2021

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Stretchable electronics has emerged over the past decade and is now expected to bring form factor-free innovation in the next-generation electronic devices. Stretchable devices have evolved with the synthesis of new soft materials and new device architectures that require significant deformability while maintaining the high device performance of the conventional rigid devices. As the mismatch in the mechanical stiffness between materials, layers, and device units is the major challenge for stretchable electronics, interface control in varying scales determines the device characteristics and the level of stretchability. This article reviews the recent advances in interface control for stretchable electronic devices. It summarizes the design principles and covers the representative approaches for solving the technological issues related to interfaces at different scales: i) nano-and microscale interfaces between materials, ii) mesoscale interfaces between layers or microstructures, and iii) macroscale interfaces between unit devices, substrates, or electrical connections. The last section discusses the current issues and future challenges of the interfaces for stretchable devices.

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Section: Strain Engineering In Double-layer Interfacesmentioning

confidence: 99%

Section: Perspectives and Challengesmentioning

confidence: 99%

Section: Design Of Mesoscale Interfacesmentioning

confidence: 99%

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Interface Design for Stretchable Electronic Devices

2021

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“…Flexible electronics show great promise to enable a variety of new applications for energy conversion and storage, food security tags, environmental monitoring, personalized healthcare, and bioinspired soft robotics [ 1 , 2 , 3 , 4 , 5 ]. The graphene is widely used as an ideal electrode material to develop supercapacitors [ 6 ], sensors [ 7 , 8 , 9 ], transistors [ 10 , 11 ], and photodetectors [ 12 , 13 ], owing to its extremely high specific surface area (2630 m 2 g −1 ) and excellent conductivity (200 S m −1 ).…”

Section: Introductionmentioning

confidence: 99%

Direct Laser Writing of Transparent Polyimide Film for Supercapacitor

et al. 2020

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Direct laser writing (DLW) is a convenient approach for fabricating graphene-based flexible electronic devices. In this paper, laser-induced graphene was successfully prepared on a thin and transparent polyimide film through the DLW process. Experiments have demonstrated that interdigital thin film capacitor prepared by the DLW method has a high specific capacitance of 8.11 mF/cm2 and volume capacitance density of 3.16 F/cm3 (0.05 mA/cm2) due to the doped fluoride in the laser-induced graphene. The capacitance is about 20 times larger than the super-capacitor based non-transparent polyimide film of the same thickness. Owing to its thin, flexible, higher electrochemical characteristics, the transparent polyimide film is promising for integrating and powering portable and wearable electronics.

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“…personalized) electronics has significantly increased, the next-generation e-skin circuits will be developed to be conformable to the arbitrary shapes of the human body or soft robots [6]. To achieve these requirements, it is necessary to introduce mechanically compliant soft platforms and associated fabrication strategies with a high-degreeof-freedom design [7][8][9][10][11][12]. In this regard, additive inkjet printing is one of the most attractive candidates due to its easy customization through its direct writing, scalability, and low-temperature processing abilities [13].…”

Section: Introductionmentioning

confidence: 99%

Stretchable strain-tolerant soft printed circuit board: a systematic approach for the design rules of stretchable interconnects

Cho

Lee

et al. 2019

Journal of Information Display

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Reported herein is a stretchable strain-tolerant soft printed circuit board (SPCB) following optimized circuit design rules. Inkjet-printed interconnects with a wrinkled structure and rigid epoxy patterns allow the outstanding stretchability and strain distribution controllability of the SPCB, respectively. The prototype circuits show reliable operation under various mechanical deformations, even in the 180˚folding state and the irregular deformed state with 25% tensile strain. This research paves a promising route for the realization of highly reliable soft printed circuits with a high degree of design freedom, which can thus be used for driver chip mounting or driver board interconnection for the stretchable display applications.

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Seamless modulus gradient structures for highly resilient, stretchable system integration

Cited by 35 publications

References 32 publications

Interface Design for Stretchable Electronic Devices

Interface Design for Stretchable Electronic Devices

Direct Laser Writing of Transparent Polyimide Film for Supercapacitor

Stretchable strain-tolerant soft printed circuit board: a systematic approach for the design rules of stretchable interconnects

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