Screening of electroplating additive for improving throwing power of copper pyrophosphate bath via molecular dynamics simulation

Li, Qingyang; Hu, Jiaping; Zhang, Jinqiu; Yang, Peixia; Hu, Yunxia; Liu, Anmin

doi:10.1016/j.cplett.2020.137848

Cited by 14 publications

(4 citation statements)

References 27 publications

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“…Bennett and Fleming et al [30,31] reported an absorption peak at about 228.0 nm for coordination behavior between En and cupric ion. Therefore, the absorption peak at 230.5 nm is attributed to the lone pair electrons of N atom in En undergoing n!σ* transition 5) and 20 mm En (6) for the coordination between En and cupric ion. Similarly, from Figure 1a curve 5 in the potassium citrate and copper sulfate mixed solution, an absorption peak at 263.5 nm is also observed for the n!π* transition of CitÀ Cu coordination ion.…”

Section: Coordination Behaviors Of Cit and En To Cu (Ii) Ionmentioning

confidence: 98%

“…Whereas, the obtained copper coating was in poor adhesion to its substrate, the bath was in low stability and the wastewater contained large quantities of phosphorus contaminant. [6,7] Acid sulfate copper electroplating has been the most commonly used technology in the PCB hole metallization. [8,9] The additives in the acid sulfate copper electroplating bath are categorized as the accelerator such as bis-(sodium sulfopropyl)-disulfide (SPS), the inhibitor such as polyethylene glycol (PEG), and the leveler such as Janus Green B (JGB).…”

Section: Introductionmentioning

confidence: 99%

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Toward Preeminent Throwing Power from a Novel Alkaline Copper Electronic Electroplating Bath with Composite Coordination Agents

Jin

Yang

et al. 2022

ChemElectroChem

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In this work, an electronic copper electroplating bath with low copper ion concentration and preeminent throwing power in through hole (TH) thickening of the printed circuit board (PCB) was successfully developed. Based upon the weak alkaline bath containing the composite complexants of citrate (Cit) and ethylenediamine (En), their synergistic effects on the preeminent bath throwing power were carefully investigated and theoretically proved. The UV‐vis spectroscopy results illustrated that En exhibited a stronger coordination ability with Cu (II) ion than citrate, and the stoichiometric coordination ratio between En and Cu (II) ion was 2 : 1. The linear sweep voltammetry (LSV) results showed that the electro‐reduction peak potential of Cit−Cu coordination ion was −0.55 V (vs. Hg/HgO), whereas that of En−Cu ion was at a more negative potential of −0.82 V. The in situ Fourier transform infrared (FTIR) spectroscopy revealed that the adsorptions of the Cit−Cu and En−Cu coordination ions were potential dependent on the copper electrode. The Cit−Cu coordination ion was easily adsorbed at the interior sites of through holes with lower over‐potential to promote the growth of copper coating. Moreover, the En−Cu coordination ion adsorbed preferably on the surface and the edge of through hole for its higher electro‐reduction overpotential, to hinder the germinating of copper nuclear. The cross‐section observation of optical microscope proved that the throwing power of novel copper electroplating bath behaved surpassingly, up to 105.8 %.

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Section: Coordination Behaviors Of Cit and En To Cu (Ii) Ionmentioning

confidence: 98%

Section: Introductionmentioning

confidence: 99%

Toward Preeminent Throwing Power from a Novel Alkaline Copper Electronic Electroplating Bath with Composite Coordination Agents

Jin

Yang

et al. 2022

ChemElectroChem

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“…29 Li et al used MD simulations to study the adsorptions of glycerol, erythritol, xylitol, and glucose on copper surfaces to understand the effect of additives on the throwing power of copper pyrophosphate baths. 30 Kornherr et al employed MD simulations to explore the structural behavior of various silane molecules adsorbing on a ZnO surface in isopropanol and demonstrated the dependence of the silane orientations on the chemical nature of their structures. In a previous study, we developed a novel Monte Carlo (MC) simulation algorithm by coupling the Booth dielectric function and the local simulation algorithm for the calculation of electrostatic interactions, and employed this method to study the ion solvation in aqueous solution as well as the dielectric decrement of the solution caused by ionic correlations.…”

Section: Introductionmentioning

confidence: 99%

Effects of temperature on microstructures of MSA-type electroplating solution: a coarse-grained molecular dynamics simulation

Li,

Liang,

et al. 2023

Phys. Chem. Chem. Phys.

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“…It is well known that the cathodic potential shifts to the less noble direction by adding additives to plating baths [18]. This cathodic polarization results in refining the electrodeposited crystal grains, smoothing the surface, improving the throwing power [19], and increasing hardness.…”

Section: Introductionmentioning

confidence: 99%

Random crystal orientation and tensile strength of nanocrystalline dumbbell-shaped copper thick films electrodeposited from acidic aqueous solutions containing polyethylene glycol

Kawakami,

Saeki,

Ohgai

2023

Mater. Res. Express

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Nanocrystalline thick copper films with the thickness of ∼250 μm were electrochemically synthesized from an acidic aqueous solution containing polyethylene glycol (PEG) with the average molecular weight of 3,000 to investigate the preferential crystal orientation and mechanical properties such as microhardness and tensile strength. By addition of PEG to the electrolytic bath, the cathode potential was shifted to a less noble direction during the electrodeposition and the average crystallite size of electrodeposited copper thick films was decreased. The copper thick films electrodeposited from the solution without PEG exhibited a preferentially orientation in (220) texture while that obtained from the solution containing PEG was composed of nanocrystals with random crystal orientation that containing (111) and (200) textures. The micro-Vickers hardness, tensile strength, and elongation of the electrodeposited copper thick films reached up to 133 HV, 234 MPa, and 13.1%, respectively. These improvements in mechanical properties can be explained by the grain refinement effect and the random crystal orientation effect.

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Screening of electroplating additive for improving throwing power of copper pyrophosphate bath via molecular dynamics simulation

Cited by 14 publications

References 27 publications

Toward Preeminent Throwing Power from a Novel Alkaline Copper Electronic Electroplating Bath with Composite Coordination Agents

Toward Preeminent Throwing Power from a Novel Alkaline Copper Electronic Electroplating Bath with Composite Coordination Agents

Effects of temperature on microstructures of MSA-type electroplating solution: a coarse-grained molecular dynamics simulation

Random crystal orientation and tensile strength of nanocrystalline dumbbell-shaped copper thick films electrodeposited from acidic aqueous solutions containing polyethylene glycol

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