Screen printed adhesive technologies for all-silicon optical packaging

Sasaki, S.; Tanaka, Kunihiko; Miura, Kazunori; Yano, M.

doi:10.1109/ectc.1996.550901

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“…Recently, several new packaging techniques have been proposed. An example is the adhesive sealing technique for Si platforms [1,2], in which good sealing characteristics are realized by using an adhesive material to attach an Si lid or glass cap to an Si platform on which LD and PD chips are mounted. The proper selection of adhesive material provides packaging quality similar to that of conventional metallic packaging [2].…”

Section: Introductionmentioning

confidence: 99%