Scratch induced thin film buckling for quantitative adhesion measurements

Kleinbichler, Andreas; Pfeifenberger, Manuel J.; Zechner, Johannes; Wöhlert, S.; Cordill, Megan J.

doi:10.1016/j.matdes.2018.05.062

Cited by 31 publications

(14 citation statements)

References 33 publications

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“…For each scratch track, the width of the track steadily increased with the increasing displacement of the nano-indenter into the film surface when the film was tightly bonded to the Si substrate. However, the width and the shape of the track were sharply enlarged or the film was completely peeled off from the substrate once the film started to delaminate [49]. As shown in Figure 5a, it was clear that a slight exfoliation was induced by the nano-indenter at the end of the scratch tracks for the Mo-1 sample.…”

Section: Resultsmentioning

confidence: 99%

“…For the Mo-4 and Mo-8 samples, the displacement started to fluctuate remarkably with the scratch distance when the film started to exfoliate. The nano-indenter-induced film delamination from the scratch track was an ideal way to evaluate the film adhesion on the substrate [31,49,51]; indentation methods generally rely on the onset scratch distance to cause the film to exfoliate. The average scratch distances and displacements, where the Mo/Ti film started to delaminate from the Si substrate, were recorded for all scratch tracks and have been tabulated in Table 2.…”

Section: Resultsmentioning

confidence: 99%

“…The cohesion between the Mo/Ti film and Si substrate was tested using an Agilent G200 Nano Indenter (Agilent, Santa Clara, United States) working with the scratch mode [48,49,50]. The scratch tests involved dragging a nano-indenter across the surface of the film with a continuously increasing normal load until surface buckling occurred at the critical load.…”

Section: Methodsmentioning

confidence: 99%

“…The scratch tests involved dragging a nano-indenter across the surface of the film with a continuously increasing normal load until surface buckling occurred at the critical load. The scratch experiment was explored by moving the indenter along the film surface for the first time to check the surface smoothness, followed by scratching the film with a linearly increasing normal force to a maximal load of 150 mN over a total scratch length of 500 μm [49]. The distance between the scratches was set to 100–600 μm and the scratch velocity was set to 50 μm/s.…”

Section: Methodsmentioning

confidence: 99%

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Effect of Thickness of Molybdenum Nano-Interlayer on Cohesion between Molybdenum/Titanium Multilayer Film and Silicon Substrate

et al. 2019

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Titanium (Ti) film has been used as a hydrogen storage material. The effect of the thickness of a molybdenum (Mo) nano-interlayer on the cohesive strength between a Mo/Ti multilayer film and a single crystal silicon (Si) substrate was investigated by X-ray diffraction (XRD), scanning electron microscopy (SEM), and nano-indenter. Four groups of Si/Mo/Ti multilayer films with different thicknesses of Mo and Ti films were fabricated. The XRD results showed that the introduction of the Mo layer suppressed the chemical reaction between the Ti film and Si substrate. The nano-indenter scratch results demonstrated that the cohesion between the Mo/Ti film and Si substrate decreased significantly with increasing Mo interlayer thickness. The XRD stress analysis indicated that the residual stress in the Si/Mo/Ti film was in-plane tensile stress which might be due to the lattice expansion at a high film growth temperature of 700 °C and the discrepancy of the thermal expansion coefficient between the Ti film and Si substrate. The tensile stress in the Si/Mo/Ti film decreased with increasing Mo interlayer thickness. During the cooling of the Si substrate, a greater decrease in tensile stress occurred for the thicker Mo interlayer sample, which became the driving force for reducing the cohesion between the Mo/Ti film and Si substrate. The results confirmed that the design of the Mo interlayer played an important role in the quality of the Ti film grown on Si substrate.

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Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

Section: Methodsmentioning

confidence: 99%

Section: Methodsmentioning

confidence: 99%

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Effect of Thickness of Molybdenum Nano-Interlayer on Cohesion between Molybdenum/Titanium Multilayer Film and Silicon Substrate

et al. 2019

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“…For WTi, E = 322 GPa was measured using nanoindentation with a Berkovich tip (R = 150 nm) and ν = 0.288 was determined with a rule of mixtures [25]. Indents were performed using the full available load range of a Hysitron TriboScope Nanoindenter, namely 100 µN to 10,000 µN, which corresponds to depths between 50 nm and 450 nm.…”

Section: Measuring Adhesion Energy Using Bucklesmentioning

confidence: 99%

Thin-film adhesion: A comparative study between colored picosecond acoustics and spontaneous buckles analysis

Devos

Vital-Juarez

Chargui

et al. 2021

Surface and Coatings Technology

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This paper presents some quantitative measurements of the adhesion energy of thin WTi films deposited on Si substrate. Two different techniques are applied to the same sample series. One is a mechanical test based on the analysis of spontaneously formed defects. The second is based on acoustic waves whose reflection at the interface between the thin-film and the substrate is sensitive to the adhesion. An excellent correlation is obtained between both approaches: the adhesion energy measured by buckles analysis and acoustic reflection coefficient measured by picosecond acoustics. The acoustic approach offers several advantages among which a nondestructive character, a compatibility with complex stacks and a sensitivity to detect adhesion anomaly even if no defect is formed.

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