Corporate‐fed advanced microstrip arrays with improved cross‐polar isolation: Design and engineering using DGS‐integration techniques

Abstract

Integration of defected ground structure (DGS) with a single microstrip patch has been a very successful technique in minimizing its inherent issue of crosspolarized (XP) radiations. But, in many of the applications, arrays of patches are often used for which additional constraints appear along with additional sources for XP radiations. Thus, the array needs other major considerations and engineering which have been addressed in this paper for the first time. It