Schottky contact-based strain-gauge elements

Abstract

This paper presents t h e results of investigations of Schottlqy contact-based s i l i c o n strain-@uge elements. The s e n s i t i v i t y of t h e strain-gauge elements t o deformation and temperature is shown t o be essentially connected with t h e degree of imperfection of t h e s i l i c o n lapr near t h e surface. The highest strain s e n s i t i v i t y and thermal s t a b i l i t y are reaohed i n t h e str-uge elements, whose s i l i c o n lager near the surface contains looal dislocation clusters of increased density. This is associated with t h e resonant tunneling currents flowing in such strain-gauge elements under t h e reverse bias, whose dependence on t h e strain and bias voltage is m h stronger, and on t h e temperature mwh weaker, than those dependences f o r thermionic currents. The strain-gauge elements manufactured had t h e pressure s e n s i t i v i t y coefficient of up t o 10000.

Fabrication of Six Degrees-of-Freedom Hexflex Positioner With Integrated Strain Sensing Using Nonlithographically Based Microfabrication

“…Absent gages 1 and 3 the average in-and out-of-plane model error is 1% and 3%, respectively, so the models appear to be capturing the dominant gage factor attenuation effects. Several sources are suggested to account for the slight underprediction, including: (i) wafer flat misalignment, (ii) gage misalignment, (iii) flexure fillets strain attenuation, (iv) Schottky barrier piezoresistance [61], (v) test fixture compliance, and (vi) gage factor nonlinearity coupled with thermal preload, all described in more detail in Ref. [37].…”