2020
DOI: 10.1016/j.mee.2019.111182
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Schottky barrier diodes fabricated with metal oxides AgOx/IGZO

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Cited by 10 publications
(7 citation statements)
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“…Introducing of 20% O2 during the sputtering of IGZO after bottom electrode treatment and post-annealing at 200°C were applied to fabricate Schottky diodes with a rectification ratio up to 10 8 and ideality factor of 1.22 [11]. Thermal annealing at 200°C and an oxygen-containing atmosphere were utilized for the fabrication of the AgOx/IGZO Schottky diodes with rectification ratio of 10 9 at ±2 V and an ideality factor of 1.7 [12]. The Pt/IGZO Schottky diodes on flexible plastic substrates operating beyond 2.45 GHz were fabricated by applying UV-ozone treatment and 3% O2 atmosphere during the IGZO sputtering without any thermal annealing process [13].…”
Section: Introductionmentioning
confidence: 99%
“…Introducing of 20% O2 during the sputtering of IGZO after bottom electrode treatment and post-annealing at 200°C were applied to fabricate Schottky diodes with a rectification ratio up to 10 8 and ideality factor of 1.22 [11]. Thermal annealing at 200°C and an oxygen-containing atmosphere were utilized for the fabrication of the AgOx/IGZO Schottky diodes with rectification ratio of 10 9 at ±2 V and an ideality factor of 1.7 [12]. The Pt/IGZO Schottky diodes on flexible plastic substrates operating beyond 2.45 GHz were fabricated by applying UV-ozone treatment and 3% O2 atmosphere during the IGZO sputtering without any thermal annealing process [13].…”
Section: Introductionmentioning
confidence: 99%
“…The values for E D and N D were taken from [ 16 ]. The typical value and the range of W G were determined considering the reported values in [ 18 , 21 ]. The value for W S/D was taken from [ 22 ].…”
Section: Methodsmentioning
confidence: 99%
“…Various processes and material optimizations were investigated to obtain a sufficiently oxidized Schottky contact. [17][18][19][20]27,[29][30][31][32][33][34] Moreover, the Schottky barrier can be deteriorated by the external dopant-induced defects, [31] such as those defects related to hydrogen (H) and water (H 2 O) from the H-containing processes or ambient humidity. Although the hydrogenation of AOS may benefit the rectification performance of SBDs by reducing the on-state resistance (R on ), [33] it is also of high possibility to bring about instabilities due to the H-related defects [35,36] and the thermal instability nature of H dopants.…”
Section: Doi: 101002/aelm202200280mentioning
confidence: 99%