Abstract:Scatterometry has been most commonly applied to CD metrology of line/space grating structures. However, for the process development and control of 3D structures for contact hole lithography applications, the current metrology methods of CD-SEM, electrical CD (ECD) and/or cross-sectional SEM (X-SEM) produce the desired information either (a) as an incomplete solution, (b) too late in process flow, or (c) in a destructive manner. In this paper, we will present use cases for the application of scatterometry to 3D… Show more
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