Scanning Acoustic Microscopy Case Studies of Microelectronic Packaging

Barton, John; Compagno, Tony; Barrett, J.

doi:10.1007/0-306-47107-8_37

Cited by 1 publication

(2 citation statements)

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“…Also, this long wire length will provide enough gaps between top and bottom substrates for filling with underfill [23] for mechanical stability [24]. For further the usefulness of nanowire arrays as a Z -axis interconnect, the wires need to be bonded on the pre-patterned pads of the wafer/devices.…”

Section: Resultsmentioning

confidence: 99%

“…The ultra-long and uniform length of these nanowires are very useful for some applications, such as Z -axis interconnects, because uniform lengths will allow for large surface area contact in an electronic device, leading to maximum electrical and thermal device performance. Also, this long wire length will provide enough gaps between top and bottom substrates for filling with underfill [ 23 ] for mechanical stability [ 24 ]. For further the usefulness of nanowire arrays as a Z -axis interconnect, the wires need to be bonded on the pre-patterned pads of the wafer/devices.…”

Section: Resultsmentioning

confidence: 99%

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Ultra-long metal nanowire arrays on solid substrate with strong bonding

Chen

Mathewson

et al. 2011

Nanoscale Res Lett

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Ultra-long metal nanowire arrays with large circular area up to 25 mm in diameter were obtained by direct electrodeposition on metalized Si and glass substrates via a template-based method. Nanowires with uniform length up to 30 μm were obtained. Combining this deposition process with lithography technology, micrometre-sized patterned metal nanowire array pads were successfully fabricated on a glass substrate. Good adhesion between the patterned nanowire array pads and the substrate was confirmed using scanning acoustic microscopy characterization. A pull-off tensile test showed strong bonding between the nanowires and the substrate. Conducting atomic force microscopy (C-AFM) measurements showed that approximately 95% of the nanowires were electrically connected with the substrate, demonstrating its viability to use as high-density interconnect.

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Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%