“…Flexible substrates such as polyimide (Kapton), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polytetrafluoroethylene (Teflon), among others have long been employed in the printed electronics industry 30 31 32 . Owing to their intrinsic plasticity, hydrophobicity, excellent dielectric properties, thermal stability, low coefficient of thermal expansion, structural resiliency against repeated bending forces, and compatibility with roll-to-roll fabrication processes for low cost and scalable manufacturing; these flexible substrates have served as the platform of choice in various printed circuit board assemblies 33 . Recently, electrochemical devices that leverage these materials for the fabrication of thin-film sensors aim at coupling the merits of flexible substrates listed above along with their electrochemically inert nature 31 34 35 36 .…”