Scalable Fabrication of Silver Nanowires-Polyethylene Terephthalate Transparent Conductive Films by Rolling-Pressing Transfer Technique at Room Temperature

Ultra-Uniform and Very Thin Ag Nanowires Synthesized via the Synergy of Cl−, Br− and Fe3+ for Transparent Conductive Films

“…Figure 8 depicts an AFM image and a scanned curve for work 2, respectively. It can be clearly seen that the film is very even with a root mean square roughness (Rq) of 8.17 nm, which is an outstanding feature compared with other results of TCFs [9,12,25,[71][72][73][74][75], and a comparison among them is described in detail in Table S4 in Supporting Information. Such a low surface roughness suggests that our method is able to build a nearly flat AgNW TCF.…”

Recent Development of Carbon Nanotube Transparent Conductive Films

“…The other option for TCF materials is metallic nanostructures, including metal films, conductive grids, and metallic nanowires, which have been shown to provide better properties than TCOs on plastic substrates. − However, the metallic structures often exhibit a hazy appearance, which is incompatible with display applications but has been shown to be beneficial in various photovoltaics . Metallic nanoparticles (NPs) are commonly made from silver, which has a similar cost to indium, meaning there is little financial benefit to using metallic NPs.…”

Fabrication of Embedded Silver Nanowires on Arbitrary Substrates with Enhanced Stability via Chemisorbed Alkanethiolate

“…5,6 Solution-processed AgNWs provide various advantages, such as process simplicity and high-throughput; however, they are also accompanied by several issues, including (i) high contact resistance between silver nanowires, 7 (ii) poor adhesion to substrates, 8,9 (iii) a rough surface, 10,11 and (iv) especially poor corrosion resistance. 12 Researchers have proposed various methods to address issues 4,8,11,13−24 such as mechanical pressing 15,20,21 and composite structures. 14,19 Embedding AgNWs into the polymer via a transferring process is a promising strategy to simultaneously overcome these issues.…”

“…Solution-processed AgNWs provide various advantages, such as process simplicity and high-throughput; however, they are also accompanied by several issues, including (i) high contact resistance between silver nanowires, (ii) poor adhesion to substrates, , (iii) a rough surface, , and (iv) especially poor corrosion resistance . Researchers have proposed various methods to address issues ,,,− such as mechanical pressing ,, and composite structures. , Embedding AgNWs into the polymer via a transferring process is a promising strategy to simultaneously overcome these issues. ,,− The matrix polymer could fill the voids of a AgNW network to offer a smooth surface, tighten NW-to-NW junctions, and enhance adhesion simultaneously. , The embedding structure also reduces the exposed area of AgNWs and improves their chemical stability. − However, the traditional transferring approach, which generally uses rigid silicon or glass as the donor substrate, is difficult to apply in large-scale manufacturing (e.g., the R2R process) and not suitable for curved substrates. Moreover, the fabricated AgNWs are still vulnerable under long-term exposure of oxygen or sulfide compounds due to incomplete coverage of the matrix polymer. , It is a great challenge to propose a scalable coating method that can not only fabricate AgNW TCEs on both planar and curved substrates but also simultaneously tackle the issues, as mentioned above.…”