2020
DOI: 10.1109/ted.2020.3025749
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Scalability of Quad Interface p-MTJ for 1X nm STT-MRAM With 10-ns Low Power Write Operation, 10 Years Retention and Endurance > 10¹¹

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Cited by 26 publications
(15 citation statements)
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“…The construction of the Double-MTJ employed in this work is depicted in Figure 1 a. MgO makes up the tunnel barrier and the cap layer, while CoFeB makes up the free layer. The additional CoFeB/MgO interface raises the energy barrier of STT-MTJ [ 25 ].…”
Section: Spin-transfer Torque Magnetic Tunnel Junctions and E-spinmentioning
confidence: 99%
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“…The construction of the Double-MTJ employed in this work is depicted in Figure 1 a. MgO makes up the tunnel barrier and the cap layer, while CoFeB makes up the free layer. The additional CoFeB/MgO interface raises the energy barrier of STT-MTJ [ 25 ].…”
Section: Spin-transfer Torque Magnetic Tunnel Junctions and E-spinmentioning
confidence: 99%
“…The temperature, which is determined by the surroundings and operating conditions, has a direct impact on the switching frequency for thermal disturbance MTJ (p-bit) [ 16 ]. However, the E-spin, based on Double-MTJ and having a greater thermal stability factor ∆ [ 25 ], could counteract the probability skew brought on by temperature variation. Because of this, our proposed electrical operation to adjust probability has better stability.…”
Section: Spin-transfer Torque Magnetic Tunnel Junctions and E-spinmentioning
confidence: 99%
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“…Solutions to improve the endurance of STT-MRAM have also been studied with regard to the impact of process integration and fabrication impact, accounting for the effects of process steps such as etching, encapsulation, and annealing [9], [10], [11], [14], [15]. Further solutions to improve STT-MRAM endurance include increasing the write efficiency [16] and enhancing the thermal stability [17]. It is increasingly evident that the MgO breakdown is driven by multiple mechanisms [18], [19].…”
Section: Introductionmentioning
confidence: 99%
“…MRAM technology is undergoing intense competition against other nonvolatile memory technologies like SRAM, Flash, PRAM, FeRAM, and RRAM in terms of their latency, density, and cost. [7][8][9] It has succeeded at present due to its very high endurance, low power demand, and high reliability, 8 arising from the absence of atomic motion during operation. However, the ultimate scaling performances in any technology need not correspond to the present-day leader.…”
Section: Introductionmentioning
confidence: 99%