Sandblasting induced stress release and enhanced adhesion strength of diamond films deposited on austenite stainless steel

Li, Xiao; Ye, Jiansong; Zhang, Hangcheng; Feng, Tao; Hu, Xiaojun

doi:10.1016/j.apsusc.2017.03.214

Cited by 32 publications

(10 citation statements)

References 31 publications

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“…And nitrogen content is still high in the interlayer, proving the low extent of carburization of the interlayer again. From the line scan, it is [17], the extent is obviously small. In general, when the deposition temperature is low, the extent of carbon reaction is low.…”

Section: Resultsmentioning

confidence: 99%

“…3Cr13 stainless steels with dimensions of 20×20×2 mm 3 were used as substrates in the experiment. In order to improve the adhesion, the substrates were firstly sandblasted, and the process parameters can be found in our previous publication [17].…”

Section: Methodsmentioning

confidence: 99%

“…The cross sectional sample was prepared by the conventional metallographic method. The details can be found in our previous publication [17]. The stress of diamond film and diamond phase composition was characterized by a Renishaw invia Reflex Raman spectroscopy using a 532 nm laser.…”

Section: Methodsmentioning

confidence: 99%

“…Our previous study showed that the sandblasting pretreatment preferred to decrease the stress and improve the adhesion, but the stress is still high [17]. So, the sandblasting was used in the work and it still needs to look for other method to further decrease the stress.…”

Section: Introductionmentioning

confidence: 99%

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Low-stress diamond films deposited on stainless steel by a two-step dropped power process in chemical vapor deposition

Xiao

Feng

et al. 2018

Diamond and Related Materials

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A continuous low-stress diamond film has been prepared on stainless steel by a novel two-step dropped power process using a Cr/CrN/CrTiAlN film as an interlayer. After the interlayer was deposited on the stainless steel, isolated diamond particles were firstly prepared under high power of 1800 W for 10 min in CVD, which has low stress, releasing most of thermal stress. Then, the low power of 1500 W was adopted to form continuous diamond films. The stress is obviously lower than that of the continuous diamond film deposited only in the first CVD process, indicating that the two-step dropped power process surely decreases the internal stress of the film. The blocky microstructure on sandblasted stainless steel and the existence of very small amount of pores in the diamond film are also beneficial to releases the stress.

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Section: Resultsmentioning

confidence: 99%

Section: Methodsmentioning

confidence: 99%

Section: Methodsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Low-stress diamond films deposited on stainless steel by a two-step dropped power process in chemical vapor deposition

Xiao

Feng

et al. 2018

Diamond and Related Materials

Self Cite

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“…These intermediate layer thicknesses are around 1 µm. The alternative found for the deposition of adherent film on such intermediate layers was the decrease of the diamond growth temperature, which minimizes thermal stress [34,40]. The works also mention diamond films of small thicknesses because the high thermal stress induces delamination of thicker films.…”

Section: Overview Of the State Of The Art For Cvd Diamond Growth On Smentioning

confidence: 99%

Interlayers Applied to CVD Diamond Deposition on Steel Substrate: A Review

et al. 2017

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Academics and industry have sought after combining the exceptional properties of diamonds with the toughness of steel. Since the early 1990s several partial solutions have been found but chemical vapor deposition (CVD) diamond deposition on steel substrate continues to be a persistent problem. The main drawbacks are the high carbon diffusion from gas phase into substrate, the transition metals on the material surface that catalyze sp 2 bond formation, instead of sp 3 bonds, and the high thermal expansion coefficient (TEC) mismatch between diamond and steels. An intermediate layer has been found necessary to increase diamond adhesion. Literature has proposed many efficient intermediate layers as a diffusion barrier for both, carbon and iron, but most intermediate layers shown have not solved TEC mismatch. In this review, we briefly discuss the solutions that exclusively work as diffusion barrier and discuss in a broader way the ones that also solve, or may potentially solve, the TEC mismatch problem. We examine some multilayers, the iron borides, the chromium carbides, and vanadium carbides. We go through the most relevant results of the last two and a half decades, including recent advances in our group. Vanadium carbide looks promising since it has shown excellent diffusion barrier properties, its TEC is intermediary between diamond and steel and, it has been thickened to manage thermal stress relief. We also review a new deposition technique to set up intermediate layers: laser cladding. It is promising because of its versatility in mixing different materials and fusing and/or sintering them on a steel surface. We conclude by remarking on new perspectives.

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Diamond Nanostructures at Different Dimensions: Synthesis and Applications

Li,

Yang,

Jiang

et al. 2024

Adv Funct Materials

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Diamond materials at different nanoscales provide them various characteristics such as elastic mechanical properties in needle‐like nanotips, flexibility of 2D films having atomic thicknesses and constant hardness under high pressures, superior field electron emission properties of vertically wall‐like composites, unprecedented hardness and improved toughness of nanotwin diamond (nt‐diamond), while the inherent excellent properties of bulk diamond (e.g., high Young's modulus, robustness, biocompatibility) can be maintained. In this paper, the newly born 1D diamond nanothreads, 2D diamanes, as well as 3D nt‐diamond are briefly reviewed. The innovations, progresses and achievements of different dimensional diamond nanostructures, covering lines, planes and volumes are overviewed. The topical problems and future outlooks of diamond nanostructures are outlined and discussed.

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Sandblasting induced stress release and enhanced adhesion strength of diamond films deposited on austenite stainless steel

Cited by 32 publications

References 31 publications

Low-stress diamond films deposited on stainless steel by a two-step dropped power process in chemical vapor deposition

Low-stress diamond films deposited on stainless steel by a two-step dropped power process in chemical vapor deposition

Interlayers Applied to CVD Diamond Deposition on Steel Substrate: A Review

Diamond Nanostructures at Different Dimensions: Synthesis and Applications

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