Sampling inspection and quality control

Dudding, Bernard P.

doi:10.1049/jipe.1942.0002

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2013

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“…Depending on the production environment, different sampling strategies have to be developed. This is not recent in semiconductor manufacturing [7] [8] [9]. One of the main reasons is that a 100-percent inspection does not provide 100-percent quality since, in semiconductor manufacturing, the inspection is never totally reliable and can easily introduce an error of almost the same order as the fraction of defectives [10].…”

Section: Introductionmentioning

confidence: 99%

A Literature Review on Sampling Techniques in Semiconductor Manufacturing

Nduhura-Munga

Rodriguez-Verjan

Dauzère‐Pérès

et al. 2013

IEEE Trans. Semicond. Manufact.

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This paper reviews sampling techniques for inspection in semiconductor manufacturing. We discuss the strengths and weaknesses of techniques developed in the last last 20 years for excursion monitoring (when a process or machine falls out of specifications) and control. Sampling techniques are classified into three main groups: static, adaptive, and dynamic. For each group, a classification is performed per year, approach, and industrial deployment. A comparison between the groups indicates a complementarity strongly linked to the semiconductor environment. Benefits and drawbacks of each group are discussed, showing significant improvements from static to dynamic through adaptive sampling techniques. Dynamic sampling seems to be more appropriate for modern semiconductor plants.

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Section: Introductionmentioning

confidence: 99%