Highly conductive fillers are an essential raw material
in the
fabrication of conductive composites, paste, ink, adhesive, etc. Still,
susceptibility to salt spray erosion remains a serious issue for silver-based
fillers. Herein, we first prepared highly conductive silver-plated
microspherical silica (Ag/pSiO2) through catechol/polyamine
surface functionalization and subsequently formed a self-assembled
inhibition layer on the surface of Ag/pSiO2 by using (3-mercaptopropyl)trimethoxysilane
(KH590) to enhance the salt spray erosion resistance. The results
suggested that the self-assembled KH590 greatly improved the salt
spray erosion resistance of the Ag/pSiO2. The total shielding
effectiveness (SEt) of the composites protected by KH590 was 106 dB
after the salt spray erosion, which was even 16 dB higher than that
before erosion. In contrast, the SEt of the composites without KH590
decreased significantly from 111 to 76 dB. Further studies revealed
that the KH590 inhibitor strongly prevented the penetration of Cl– and subsequently enhanced the salt spray resistance.
Considering the facile and effective preparation, this strategy could
be applied in large-scale silver-based EMI shielding materials.