Saechtling Kunststoff Taschenbuch

Baur, Erwin; Brinkmann, Sigrid; Osswald, Tim A.; Schmachtenberg, Ernst

doi:10.3139/9783446414372

Cited by 71 publications

(51 citation statements)

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“…As the temperature decreases, the linear coefficient of expansion increases to an upper value of 200 • 10 −6 /K to 300 • 10 −6 /K. .…”

Section: Methodsmentioning

confidence: 99%

“…However, PP has a higher stiffness and strength compared to PE. PP can be sterilized very well in superheated steam and ethylene oxide (EO) , swells little and is slightly permeable to water . It is also characterized by a better bondability compared to PE .…”

Section: Methodsmentioning

confidence: 99%

“…Even if PMMA tends toward stress cracking and can exhibit problems in hot steam and EO sterilization, the moisture and water absorption are low . Furthermore, PMMA is easy to polish, which is of particular interest for micrograph analysis . PMMA Lucite® Diakon® CLG356 from Lucite International Holland B.V. (Botlek Rotterdam, the Netherlands) was used in the study.…”

Section: Methodsmentioning

confidence: 99%

“…PSU is attacked under the permanent influence of hot water. Due to the high processing temperatures, a continuous operating temperature of up to 150°C is possible . PSU UDEL® P‐1700 NT11 from Solvay Specialty Polymers USA, LLC (Alpharetta, GA) was used in the study.…”

Section: Methodsmentioning

confidence: 99%

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Thermoplastic encapsulations of a sensor platform by high‐temperature injection molding up to 360°C

Werner

Krumpholz

Rehekampff

et al. 2019

Polymer Engineering & Sci

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For bioprotective encapsulated Internet of Things (IoT) electronics for the medical market, especially for cost‐effective, single or multiple use, injection molding will be of major importance. The stresses from the production process pose special challenges for electronics. The aim of the study was the simulative and experimental characterization of the load spectrum from the injection molding process and its effects on electronics. General recommendations for the encapsulation of IoT electronics in polymer matrices were derived. A microcontroller‐controlled temperature sensor board and a suitable injection mold were developed. Eight circumferential NTC‐sensors measured the prevailing thermal load directly on the component during overmolding. A simulation model allowed statements on the loads to be made about individual components, validated in experimental tests. In addition to PP and PMMA, PSU with a melt temperature of 360°C was tested. The temperature influence of the melt could be described as a function of the component position. The loss of adhesion, shrinkage, distortion, cavities, and delamination were analyzed using micrograph analysis. Complete functionality of the electronics was ensured after encapsulation. Optimization strategies were developed for the design of both IoT electronics and the injection mold. Novel concepts such as interlayer or backfill vias could be derived for future research approaches. POLYM. ENG. SCI., 59:1315–1331 2019. © 2019 Society of Plastics Engineers

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“…As the temperature decreases, the linear coefficient of expansion increases to an upper value of 200 • 10 −6 /K to 300 • 10 −6 /K. .…”

Section: Methodsmentioning

confidence: 99%

Section: Methodsmentioning

confidence: 99%

Section: Methodsmentioning

confidence: 99%

Section: Methodsmentioning

confidence: 99%

See 2 more Smart Citations

Thermoplastic encapsulations of a sensor platform by high‐temperature injection molding up to 360°C

Werner

Krumpholz

Rehekampff

et al. 2019

Polymer Engineering & Sci

View full text Add to dashboard Cite

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“…This semicrystalline thermoplastic polymer is one of the most commonly used polymers and currently receives much attention as a matrix material for future automotive composite structures. Common material properties of polyamide-6 and the quasi-static mechanical properties of short glass fiber reinforced polyamide-6 are well documented [1][2][3].…”

Section: Introductionmentioning

confidence: 99%

Characterization of unidirectional carbon fiber reinforced polyamide-6 thermoplastic composite under longitudinal compression loading at high strain rate

Ploeckl¹,

Kühn²,

Koêrber³

2015

EPJ Web of Conferences

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Abstract. In the presented work, an experimental investigation has been performed to characterize the strain rate dependency of unidirectional carbon fiber reinforced polyamide-6 composite for longitudinal compression loading. An end-loaded compression specimen geometry, suitable for contactless optical strain measurement via digital image correlation and dynamic loading in a split-Hopkinson pressure bar, was developed. For the dynamic experiments at a constant strain rate of 100 s −1 a modified version of the Dynamic Compression Fixture, developed by Koerber and Camanho [Koerber and Camanho, Composites Part A, 42, 462-470, 2011] was used. The results were compared with quasi-static test results at a strain rate of 3 · 10 −4 s −1 using the same specimen geometry. It was found that the longitudinal compressive strength increased by 61% compared to the strength value obtained from the quasi-static tests.

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