S-parameter extraction of bond wires based on EM field simulations of computed tomography-generated 3D CAD models

Hillebrand, Jurgen; Kieß, Steffen; Wróblewski, Marek; Simon, Sven

doi:10.1109/sapiw.2012.6222907

Cited by 5 publications

(6 citation statements)

References 2 publications

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“…The value of the total compensation capacitance in the bonding area is: 15

C_{Compensation} goodbreak= \frac{L_{italiceq}}{Z_{0}^{2}}

where Z 0 is the characteristic impedance of the circuit. In this work, for the bonding wire with a span of 2 mm and a diameter of 25 μm, the equivalent inductance L eq is assumed to be 2.5 nH 5 . Accordingly, the total compensation capacitance in the bonding area is 1 pF.…”

Section: Electromagnetic Field Numerical Simulationmentioning

confidence: 99%

“…They also compared and analyzed the S parameters obtained from the FDTD model and the quasi‐static model. Hillebrand et al 5 extracted the S parameters of bonding wires using three‐dimensional field simulator based on the generation of bond wire CAD models from computed tomography image data. Since et al 6 discussed the package electrical modeling methodology from the perspective of both time domain and frequency domain.…”

Section: Introductionmentioning

confidence: 99%

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Investigation of impedance compensation in radio frequency circuits with bonding wire

Wang

Gao

Flowers

et al. 2022

Int J RF Mic Comp-Aid Eng

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Bonding wires are extensively used to provide electrical interconnections in communication systems. From the perspective of circuit analysis, the effects of such elements are often treated as an inductance. Bonding wires may cause inductive impedance discontinuity, which negatively impacts signal integrity. In this work, an impedance compensation technique using a chip capacitor was introduced. The electrical performance was improved significantly in the frequency band below 4 GHz. In order to expand the operating frequency of the circuit, another compensation approach based on adding a ground conductor was also studied. This compensation strategy is shown to be effective for frequencies up to 18 GHz. The results obtained from the model simulation for both strategies were also validated experimentally. The model simulation results for both approaches show good agreement with those obtained from the experimental measurements.

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“…The value of the total compensation capacitance in the bonding area is: 15

C_{Compensation} goodbreak= \frac{L_{italiceq}}{Z_{0}^{2}}

Section: Electromagnetic Field Numerical Simulationmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Investigation of impedance compensation in radio frequency circuits with bonding wire

Wang

Gao

Flowers

et al. 2022

Int J RF Mic Comp-Aid Eng

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“…Thinning-based methods have advantages for structures that cannot easily be extracted from the voxel dataset, for example, objects like bond wires that have a cross section comparable to the resolution of the CT scan [12]. For this method, only the skeleton of the object is extracted and transformed into an approximated wire, see Fig.…”

Section: B Algorithms For Extracting Simulation Modelsmentioning

confidence: 99%

“…The maximum PCB width L w ,PCB can be obtained by substituting (1) with L w ,PCB = 2 · FOD into (10) and rewriting to L w ,PCB , see (12). For model extraction of PCBs wider than maximum L w ,PCB , a standard CT scan for a given resolution can be difficult to perform.…”

Section: B Required Ct Voxel Resolution For Extracting Stripline Modelsmentioning

confidence: 99%

“…The required voxel resolution that adheres to a desired uncertainty for U (Z L )/Z L becomes coarser as the accuracy with which the external variables can be determined gets higher. According to (12), this provides the particular advantage that larger areas of the specimen can be detected and less CT scans for capturing the whole specimen are required. This makes it possible to reduce the time necessary for scanning a whole specimen considerably.…”

Section: Required Ct Voxel Resolution For Extracting Stripline Modelsmentioning

confidence: 99%

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Signal Integrity Model Extraction Based on Computed Tomography Scans—Analysis of the Required Voxel Resolution

Hillebrand

Kies

Guhathakurta

et al. 2015

IEEE Trans. Electromagn. Compat.

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Signal integrity (SI) analysis based on state-of-theart measurements can be difficult to perform especially when the structures of interest are on inner layers of multilayer boards or are enclosed by IC packages. To enable an SI analysis in such cases the authors have recently developed a method that is based on the extraction of accurate simulation models from computed tomography (CT) scans. These models can be used in electromagnetic (EM) field simulators for computer-aided SI analyses. Such CT-based models include geometry variations or defects due to the manufacturing process so that computed EM field simulation results have a good correlation with common measurements. In order to identify the potential of the method an analysis of the required voxel resolution for the extraction of single-ended and differential striplines is presented. The analysis is based on the measurement uncertainty of length measurements in CT scans and an analysis of the propagation of uncertainty for the characteristic impedances of single-ended and differential striplines. This analysis shows that the voxel resolution of industrial CT scans is well suited for the extraction of accurate simulation models which can be used for an SI analysis. His research interests include computed-tomography-based analysis of the electrical parameters of RF and high-speed digital circuits. He is also interested in EM field simulation as well as compute-intensive sensor systems like computed tomography systems. Mr. Hillebrand received the graduate price in 2014 from the Real-Time Systems Committee of the Gesellschaft für Informatik e.V. of the ITG -VDI/VDE for his master thesis.Steffen Kieß received the Diploma degree in software engineering from the University of Stuttgart, Stuttgart, Germany in 2010, where he is currently working toward the Ph. D. degree.In 2011, he joined the Parallel Systems Department, Institute of Parallel and Distributed Systems, University of Stuttgart. Topic of his diploma thesis was the parallelization of the Discrete Dipole Approximation for electromagnetic field simulations. After his diploma thesis, he focused on the finite-difference time-domain methods on hardware accelerators. His current research interests include the extraction of models for electromagnetic field simulations based on computed tomography, parallel electromagnetic field simulations and parallel systems.

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Impact of Impedance Change Caused by Bonding Wire Connection on Signal Transmission

Wang

Flowers

Gao

et al. 2020

2020 IEEE 66th Holm Conference on Electrical Contacts and Intensive Course (HLM)

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S-parameter extraction of bond wires based on EM field simulations of computed tomography-generated 3D CAD models

Cited by 5 publications

References 2 publications

Investigation of impedance compensation in radio frequency circuits with bonding wire

Investigation of impedance compensation in radio frequency circuits with bonding wire

Signal Integrity Model Extraction Based on Computed Tomography Scans—Analysis of the Required Voxel Resolution

Impact of Impedance Change Caused by Bonding Wire Connection on Signal Transmission

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