Abstract:On-chip temperature and stress sensors are important for runtime system management techniques tackling thermomechanical reliability issues in 3-D integrated circuits (ICs). However, traditional temperature and stress sensor designs require large calibration overhead to improve accuracy, which incurs significant cost for massive production. To address the challenge, in this paper, we propose a novel temperature-stress cosensor design for 3-D ICs. By exploring the inherent reciprocity of temperature and stress m… Show more
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