Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and F
DOI: 10.1109/iemt.1995.526097
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Run by run control of chemical-mechanical polishing

Abstract: A prototype hardware/software system has been developed and applied to the control of single wafer chemicalmechanical polishing (CMP) processes. The control methodology consists of experimental design to build response surface and linearized control models of the process, and the use of feedback control to change recipe parameters (machine settings) on a lot by lot basis. Acceptable regression models for a single wafer polishing tool and process were constructed for average removal rate and nonuniformity which… Show more

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Cited by 65 publications
(43 citation statements)
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“…control problem that appears in semiconductor manufacturing where batch processing is the norm; see [41], [42], [43], [44]. The loop-shaping procedure is done using the normalized coprime factorization ℋ ∞ design methods of Glover and…”
Section: More Recent Work Done By Tsakalis Et Al [11] [4] [12] [13] Umentioning
confidence: 99%
“…control problem that appears in semiconductor manufacturing where batch processing is the norm; see [41], [42], [43], [44]. The loop-shaping procedure is done using the normalized coprime factorization ℋ ∞ design methods of Glover and…”
Section: More Recent Work Done By Tsakalis Et Al [11] [4] [12] [13] Umentioning
confidence: 99%
“…Various strategies have emerged to address this concern, including ex-situ and in-situ pad conditioning, and run by run control. In previous work, we have demonstrated run by run control on blanket wafers, in which polish time and other process parameters are adjusted for the next or later wafer based on measurements on a previous wafer to compensate for removal rate and uniformity degradation [10,11]. In practical use, however, such run by run control faces additional barriers to adoption.…”
Section: Ild Cmp Run By Run Controlmentioning
confidence: 99%
“…This need has originated a collection of techniques called RtR control (Baras & Patel, 1996;Sachs, Hu, & Ingolfsson, 1995;Boning, Moyne, & Smith, 1995;Castillo & Yeh, 1998;Hankinson, Vincent, Irani, & Khargonekar, 1997;Ingolfsson & Sachs, 1993;Ning, 1996;Deng, 1999). RtR control is a form of discrete-time process control in which the product recipe with respect to a particular equipment process is modiÿed ex situ, i.e.…”
Section: Introductionmentioning
confidence: 99%