Abstract:A novel ultrasonic bonding technique for semiconductor thin-dies laminated with die attach films (DAFs) is proposed to improve the process window and to increase the throughput limited intrinsically in the state-of-the-art thermocompression bonding technique. The proposed technique involves the introduction of ultrasonic vibration energy generated from an ultrasonic transducer to the DAFs underneath the thindies so as to adhere the thin-die-DAF laminates onto the substrates. In this paper, a 40 kHz piezocerami… Show more
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