Abstract:This letter describes a direct Cu bonding technology to there-dimensionally integrate heterogeneous dielets based on a chip-on-wafer configuration. 100-μm-cubed blue μLEDs temporarily adhered on a photosensitive resin are interconnected by semi-additive plating (SAP) without thermal compression bonding. By using SAP bonding, a lot of dielets can be stacked on thin 3D-IC chiplets. The following three key technologies are applied to solve the yield issues of SAP bonding. After pick-and-place assembly, additional… Show more
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