Room-Temperature Direct Bonding Using Fluorine Containing Plasma Activation

Wang, Chenxi; Suga, Tadatomo

doi:10.1149/1.3560510

Cited by 30 publications

(24 citation statements)

References 12 publications

(22 reference statements)

Supporting

Mentioning

Contrasting

Order By: Relevance

“…12b), which was characterized by X-ray photoelectron spectroscopy (XPS) measurements. 10 Thus, adding CF 4 into O 2 plasma could restrict the amount of water molecules adsorbed on surface according to the less hydrophilic surfaces (Fig. 12c).…”

Section: Resultsmentioning

confidence: 98%

“…In our experiment, adding a small amount of CF 4 to O 2 plasma leads to an increasing of bonding strength at RT in our previous study. 10 It is known that fluorine radicals may generated from the discharged CF 4 . These fluorine radicals are so active and very easily react with the native oxide layer to form a fluorinated oxide layer (Fig.…”

Section: Resultsmentioning

confidence: 99%

“…10 All the wafers were bonded at room temperature and rolled under a pressure force of 735 N. The wafers were prepared with different plasma treatment conditions prior to bonding and were categorized into Groups A, B and C as listed in Table I. A cumulative annealing was employed and the bonded wafer pairs were heated at 200, 300, 400, 500, 600, 700 and 800…”

Section: Methodsmentioning

confidence: 99%

“…10,11 It seems that the fluorinated oxide allows water and hydrogen to diffuse out more easily from the interface at room temperature. But we had no idea as to how voids will be generated at elevated temperatures during subsequent annealing processes.…”

mentioning

confidence: 99%

See 3 more Smart Citations

A Comparative Study: Void Formation in Silicon Wafer Direct Bonding by Oxygen Plasma Activation with and without Fluorine

Wang

Liu

Suga

2016

ECS J. Solid State Sci. Technol.

Self Cite

View full text Add to dashboard Cite

A quantitative evaluation of void formation in plasma activated bonding of 200-mm silicon wafers is demonstrated. As a comparison, the wafers were treated with oxygen plasma or fluorine containing oxygen plasma prior to bonding, respectively. The bonding was performed at the room temperature (∼25 • C), and all the bonded pairs were annealed from 200 to 800 • C. Results shows adding a small amount of fluorine into the oxygen plasma could decrease the hydrophilicity of the silicon surfaces, and effectively mitigate void formation at the bonding interfaces during the subsequent annealing process. Moreover, long plasma treatments (e.g. >60 s) may produce more porous surfaces resulting in more annealing voids. A short fluorine containing plasma treatment (e.g. ∼10 s) is able to remove organic contaminants efficiently and causes restricted hydrophilic surfaces with less subsurface damages. It may lead to much fewer voids at bonding interfaces during the annealing. Void formation models are proposed to gain insight the mechanism of the plasma activated bonding without and with fluorine, respectively.

show abstract

Section: Resultsmentioning

confidence: 98%

Section: Resultsmentioning

confidence: 99%

Section: Methodsmentioning

confidence: 99%

mentioning

confidence: 99%

See 2 more Smart Citations

A Comparative Study: Void Formation in Silicon Wafer Direct Bonding by Oxygen Plasma Activation with and without Fluorine

Wang

Liu

Suga

2016

ECS J. Solid State Sci. Technol.

Self Cite

View full text Add to dashboard Cite

show abstract

“…11,12 However, the mixture plasma treatment is time consuming and inconvenient. Moreover, the additional fluorinated gas lines combined with accurate gas flow controllers are expensive to equip with commercial plasma chambers, which limits many applications.…”

mentioning

confidence: 99%

Communication—Fluorinated Plasma Treatments Using PTFE Substrates for Room-Temperature Silicon Wafer Direct Bonding

Wang

Suga

2016

ECS J. Solid State Sci. Technol.

Self Cite

View full text Add to dashboard Cite

We introduced polytetrafluoroethylene (PTFE) substrates and silicon wafers into oxygen plasma to form fluorinated oxide layers on the silicon surfaces, similar to sputtering processes. After a short plasma treatments (∼60 s), fluorinated oxide layers were formed and could be controlled by adjusting the size of the PTFE substrates. Two wafers were brought into contact at room temperature (∼25 • C), and the surface energy was significantly improved to ∼1.8 J/m 2 , even without employing heating. This surface energy is sufficiently high to withstand subsequent mechanical processing. No defects or nanopores were observed in the bonding interface.

show abstract

Hybrid Plasma Activation Strategy for the Protein‐Coated Magnesium Implants in Orthopedic Applications

Fang

Zhou

et al. 2022

Adv Materials Inter

Self Cite

View full text Add to dashboard Cite

properties, corrosion resistance, and especially biocompatibility. Recently, silk fibroin (i.e., SF), a natural protein extracted from Bombyx mori silkworms, has been expected to be a coating strategy that protects of magnesium from corrosion for a long time. [10][11][12][13][14] This biological protein was similar to the collagen components in bone with osteogenic activity, which can endow inorganic Mg with osteoinductivity and osteoconductivity functions as a protective organic coating. However, the surface pretreatment process is essential in the application of biodegradable magnesium alloys, aiming to improve the adhesion force (or bonding strength) between organic protein coatings and inorganic magnesium substrates. [15] Thus, strong bonding at the interface can reinforce the anticorrosion performance of the coated structure in an immersed body fluid environment as well as the biocompatibility.Popular surface pretreatment includes chemical conversion, [16,17] microarc oxidation (MAO), [18,19] and intermediate layers, [20,21] which leads to some concerns regarding reliability or biosafety with increasing reports of clinical trials. The chemical conversion method applies alkaline or acid solutions on magnesium surfaces to form magnesium hydroxide [22] or magnesium fluoride, [23] which is simple and inexpensive. A single chemical conversion layer cannot provide long-term protection yet, and the biosafety of fluorine in vivo needs further confirmation. Although MAO is one of the most widely commercialized surface treatment technologies for magnesium, coatings are usually brittle with holes. Some materials such as poly dopamine [24] or 3-amino-propyltriethoxysilane (APTES, reported by our previous work) [25] are considered intermediate layers to generate bonds between outer coatings and magnesium substrates. However, their biodegradable behaviors are not controlled, and the biocompatibility of APTES is not clear. Generally, all the surface pretreatment technologies above provide one or more intermediate layers between coatings and substrates to improve adhesion at the bonding interfaces. [26][27][28][29] Some problems, including chemical residue, surface contamination, interface cracking probability, uncontrollable degradation, and biocompatibility are potential dangers when making use of intermediate layers, which form two or more bonding interfaces. [30][31][32][33] Biodegradable magnesium alloys show superior potential as bone repair implants, which are coated by natural polymers such as biological proteins to reinforce anticorrosion and biocompatibility. Surface pretreatment can facilitate the adhesion force of the organic coating/inorganic metal interface, but potentially causes one or more unfavorable intermediate layers. Herein, hybrid plasma activation is introduced to modify magnesium alloy (MgZnCa), which is directly coated by a natural protein, silk fibroin (i.e., SF), thus achieving a protein/magnesium direct bonding interface. Different plasmas exhibit distinctive physical and chemical performances o...

show abstract

Room-Temperature Direct Bonding Using Fluorine Containing Plasma Activation

Cited by 30 publications

References 12 publications

A Comparative Study: Void Formation in Silicon Wafer Direct Bonding by Oxygen Plasma Activation with and without Fluorine

A Comparative Study: Void Formation in Silicon Wafer Direct Bonding by Oxygen Plasma Activation with and without Fluorine

Communication—Fluorinated Plasma Treatments Using PTFE Substrates for Room-Temperature Silicon Wafer Direct Bonding

Hybrid Plasma Activation Strategy for the Protein‐Coated Magnesium Implants in Orthopedic Applications

Contact Info

Product

Resources

About