2011
DOI: 10.1088/0960-1317/21/8/085025
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Room temperature direct bonding of LiNbO3crystal layers and its application to high-voltage optical sensing

Abstract: LiNbO3 is a crystal widely used in photonics and acoustics, for example in electro-optic modulation, nonlinear optical frequency conversion, electric field sensing and surface acoustic wave filtering. It often needs to be combined with other materials and used in thin layers to achieve the adequate device performance. In this paper, we investigate direct bonding of LiNbO3 crystals with other dielectric materials, such as Si and fused silica (SiO2), and we show that specific surface chemical cleaning, together … Show more

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Cited by 15 publications
(4 citation statements)
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“…The fabrication flow for the hybrid silicon/lithium niobate structures is similar to the processes described in references 30 , 31 , 32 and 33 and is illustrated in Fig. 1(a) .…”
Section: Fabrication and Methodsmentioning
confidence: 99%
“…The fabrication flow for the hybrid silicon/lithium niobate structures is similar to the processes described in references 30 , 31 , 32 and 33 and is illustrated in Fig. 1(a) .…”
Section: Fabrication and Methodsmentioning
confidence: 99%
“…The SOI wafer and the LN wafer are then bonded together using a room-temperature direct bonding process (as described, eg. in [17,18]). A key limitation in the bonding process is the large thermal expansion coefficient mismatch between Si and LN (2.6 × 10 −6 K −1 for Si compared to 15.7 × 10 −6 K −1 for LN along the x and y axes [19]), which limits the temperature at which the bonding process can occur.…”
Section: Si/ln Platform Fabrication Flowmentioning
confidence: 97%
“…The need for a high temperature step is averted by using an O 2 or Ar plasma treatment to activate the surface. This treatment introduces damage to the surface and creates dangling bonds, resulting in hydrophilic surfaces with a high surface energy [17]. After surface activation a strong bond can be achieved by applying only a minimal amount of pressure.…”
Section: Si/ln Platform Fabrication Flowmentioning
confidence: 99%
“…In this section we demonstrate the application potentials of the bonding technique proposed in section 3.3 [107], for the fabrication of a highvoltage field sensor. The scheme of the proposed device is sketched in Fig.…”
Section: Application Of Room Temperature Bonding To High-voltage Opti...mentioning
confidence: 99%