Room temperature bonding of micromachined glass devices for capillary electrophoresis

Chiem, Nghia; Lockyear, Loranelle L.; Andersson, P.; Skinner, Cameron D.; Harrison, David

doi:10.1016/s0925-4005(00)00351-8

Cited by 54 publications

(49 citation statements)

References 13 publications

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“…In addition, many research groups have reported the bonding of glass microchips at room temperature without the requirements of cleanroom facilities [16,[32][33][34][35][36]. Such reported processes are strongly dependents of some factors as (i) multiple washing steps [32,33,35], (ii) need of an accurate holder to apply an equalized pressure between two glass plates [34] and (iii) still requiring instrumentation for sequential plasma activation of the glass surface [36]. However, all roomtemperature bonding processes demand high level of cleanliness and flatness of the glass surfaces [32][33][34][35][36].…”

Section: Introductionmentioning

confidence: 99%

A rapid and reliable bonding process for microchip electrophoresis fabricated in glass substrates

et al. 2010

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In this report, we describe a rapid and reliable process to bond channels fabricated in glass substrates. Glass channels were fabricated by photolithography and wet chemical etching. The resulting channels were bonded against another glass plate containing a 50-microm thick PDMS layer. This same PDMS layer was also used to provide the electrical insulation of planar electrodes to carry out capacitively coupled contactless conductivity detection. The analytical performance of the proposed device was shown by using both LIF and capacitively coupled contactless conductivity detection systems. Efficiency around 47,000 plates/m was achieved with good chip-to-chip repeatability and satisfactory long-term stability of EOF. The RSD for the EOF measured in three different devices was ca. 7%. For a chip-to-chip comparison, the RSD values for migration time, electrophoretic current and peak area were below 10%. With the proposed approach, a single chip can be fabricated in less than 30 min including patterning, etching and sealing steps. This fabrication process is faster and easier than the thermal bonding process. Besides, the proposed method does not require high temperatures and provides excellent day-to-day and device-to-device repeatability.

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Section: Introductionmentioning

confidence: 99%

A rapid and reliable bonding process for microchip electrophoresis fabricated in glass substrates

et al. 2010

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“…In addition to etching, through-holes in glass wafers can be made by drilling and powder blasting (Belloy, Sayah, & Gijs, 2000). In general, glass-glass bonding is considered easier than silicon-silicon or polymer-polymer bonding because of the wide variety of methods available for glass (Chiem et al, 2000;Daridon et al, 2001;Jia, Fang, & Fang, 2004;Easley, Humphrey, & Landers, 2007;Tiggelaar et al, 2007). Silicon-glass anodic bonding is also a routine task (Despont et al, 1996;Berthold et al, 2000;Lee et al, 2000).…”

Section: Glassmentioning

confidence: 99%

“…Bonding without an intermediate layer, known as direct or fusion bonding, is simple in the sense that no foreign material is introduced to the process and the number of material interfaces is minimized. Silicon-silicon (Christiansen, Singh, & Gösele, 2006), glass-glass (Xue et al, 1997;Chiem et al, 2000;Jia, Fang, & Fang, 2004), quartz-quartz , PMMA-PMMA (Chen et al, 2004), and many other direct bonding processes are in use. The most general purpose bonding technique, however, is adhesive bonding (Niklaus et al, 2001a(Niklaus et al, , 2006, where an intermediate layer of material is added to the system to facilitate bonding.…”

Section: Bondingmentioning

confidence: 99%

“…Glass-glass fusion bonding is typically done at around softening temperatures, for example, 6008C for Pyrex . Glass-glass bonding can also be carried out at room temperature when rigorous cleaning procedures are undertaken (Chiem et al, 2000;Jia, Fang, & Fang, 2004). Anodic bonding (field-assisted thermal bonding) of silicon and glass typically takes place at 300-4008C.…”

Section: Bondingmentioning

confidence: 99%

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Microchip technology in mass spectrometry

Sikanen

Franssila

Kauppila

et al. 2009

Mass Spectrom. Rev.

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Microfabrication of analytical devices is currently of growing interest and many microfabricated instruments have also entered the field of mass spectrometry (MS). Various (atmospheric pressure) ion sources as well as mass analyzers have been developed exploiting microfabrication techniques. The most common approach thus far has been the miniaturization of the electrospray ion source and its integration with various separation and sampling units. Other ionization techniques, mainly atmospheric pressure chemical ionization and photoionization, have also been subject to miniaturization, though they have not attracted as much attention. Likewise, all common types of mass analyzers have been realized by microfabrication and, in most cases, successfully applied to MS analysis in conjunction with on-chip ionization. This review summarizes the latest achievements in the field of microfabricated ion sources and mass analyzers. Representative applications are reviewed focusing on the development of fully microfabricated systems where ion sources or analyzers are integrated with microfluidic separation devices or microfabricated pums and detectors, respectively. Also the main microfabrication methods, with their possibilities and constraints, are briefly discussed together with the most commonly used materials.

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“…The separation channel was 120 mm wide, whereas the narrow bead introduction channel (50 or 30 mm wide) was used to deliver packing material. After drilling 2 mm diameter access holes on a 600-mm-thick Corning 0211 glass or 2-mm-thick quartz cover plates, the etched substrate was thermally bonded to the matching cover plate [28]. The channels were conditioned with 0.1 M NaOH (10 min) and doubly distilled water (10 min) before use.…”

Section: Reagentsmentioning

confidence: 99%

Capillary electrochromatography with packed bead beds in microfluidic devices

et al. 2009

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Microchip-based bead-packed columns for electrochromatography are described for several types of stationary phases. Chromatography columns 2 mm in length were used for the separation of proteins and peptides by size- and ion-exchange modes of separation, respectively. In size-exclusion electrochromatograpgy, FITC-IgG and FITC-insulin were baseline resolved in less than 10 s, with efficiencies of up to 139,000 plates/m for FITC-insulin. In strong cation-exchange electrochromatography, a mixture of three fluorescently labeled peptides was baseline resolved in less than 40 s, with efficiencies up to 400,000 plates/m. The RSD for the analytes retention times were<3% in both size-exclusion and ion-exchange modes of separations. The use of a 1-mm-long reverse-phase column for the semiquantitative evaluation of pharmaceutical formulations in drug solubility tests illustrates the use of this microfluidic chip-based electrochromatographic approach to drug development.

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Room temperature bonding of micromachined glass devices for capillary electrophoresis

Cited by 54 publications

References 13 publications

A rapid and reliable bonding process for microchip electrophoresis fabricated in glass substrates

A rapid and reliable bonding process for microchip electrophoresis fabricated in glass substrates

Microchip technology in mass spectrometry

Capillary electrochromatography with packed bead beds in microfluidic devices

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