ROM-FOM Interface Optimization for Efficient Thermomechanical Simulations of Electronic Components

Inamdar, Adwait; Hauck, Torsten; Soestbergen, Michiel van; Driel, Willem D. van; Zhang, GuoQi

doi:10.1109/eurosime60745.2024.10491495

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Cited by 3 publications

References 3 publications

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Re-Integrating a Reduced-Order Model into Finite Element Environment for Thermo-Mechanical Reliability Analysis in Microelectronics

Yuan,

Maeter,

Maniar

et al. 2024

2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)

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Re-Integrating a Reduced-Order Model into Finite Element Environment for Thermo-Mechanical Reliability Analysis in Microelectronics

Yuan,

Maeter,

Maniar

et al. 2024

2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)

View full text Add to dashboard Cite

Coupled Electrothermal Analysis with Reduced Order Models for Optimizing GaN HEMTs Performance in Traction Inverters

Pradhan,

Grosso,

Kurukuru

et al. 2024

2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)

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Digital Twin Technology—A Review and Its Application Model for Prognostics and Health Management of Microelectronics

Inamdar,

van Driel,

Zhang

2024

Electronics

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Digital Twins (DT) play a key role in Industry 4.0 applications, and the technology is in the process of being mature. Since its conceptualisation, it has been heavily contextualised and often misinterpreted as being merely a virtual model. Thus, it is crucial to define it clearly and have a deeper understanding of its architecture, workflow, and implementation scales. This paper reviews the notion of a Digital Twin represented in the literature and analyses different kinds of descriptions, including several definitions and architectural models. A new fit-for-all definition is proposed which describes the underlying technology without being context-specific and also overcomes the pitfalls of the existing generalised definitions. In addition, the existing three-dimensional and five-dimensional models of the DT architecture and their characteristic features are analysed. A new simplified two-branched model of DT is introduced, which retains a clear separation between the real and virtual spaces and outlines the latter based on the two key modelling approaches. This model is then extended for condition monitoring of electronic components and systems, and a hybrid approach to Prognostics and Health Management (PHM) is further elaborated on. The proposed framework, enabled by the two-branched Digital Twin model, combines the physics-of-degradation and data-driven approaches and empowers the next generation of reliability assessment methods. Finally, the benefits, challenges, and outlook of the proposed approach are also discussed.

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ROM-FOM Interface Optimization for Efficient Thermomechanical Simulations of Electronic Components

Cited by 3 publications

References 3 publications

Re-Integrating a Reduced-Order Model into Finite Element Environment for Thermo-Mechanical Reliability Analysis in Microelectronics

Re-Integrating a Reduced-Order Model into Finite Element Environment for Thermo-Mechanical Reliability Analysis in Microelectronics

Coupled Electrothermal Analysis with Reduced Order Models for Optimizing GaN HEMTs Performance in Traction Inverters

Digital Twin Technology—A Review and Its Application Model for Prognostics and Health Management of Microelectronics

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