2017
DOI: 10.1016/j.tsf.2017.10.014
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Role of silver nanoparticles in the dewetting behavior of copper thin films

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Cited by 14 publications
(13 citation statements)
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“…RTA has many advantages over CFA such as lower dewetting temperatures of thin metal films with an increase of heating rate, lower crystallisation temperature, minimised film substrate interface reactions, shorter annealing time, better electrical properties, and reduced thermal costs [23]. According to Bergum et al [24], rapid thermal annealing of thin layers of Cu 2 O prepared using magnetron sputtering improves their carrier transport, while Kumar et al [25] reported that RTA, owing to the faster heating rates, shorter time, and lower temperatures, promotes the formation of a smaller grain size of Cu and Ag-Cu materials. Moreover, Khaoo et al [26] achieved an increase in photovoltaic performance and external quantum efficiency for ZnO/Cu 2 O by rapid thermal annealing.…”
Section: Introductionmentioning
confidence: 99%
“…RTA has many advantages over CFA such as lower dewetting temperatures of thin metal films with an increase of heating rate, lower crystallisation temperature, minimised film substrate interface reactions, shorter annealing time, better electrical properties, and reduced thermal costs [23]. According to Bergum et al [24], rapid thermal annealing of thin layers of Cu 2 O prepared using magnetron sputtering improves their carrier transport, while Kumar et al [25] reported that RTA, owing to the faster heating rates, shorter time, and lower temperatures, promotes the formation of a smaller grain size of Cu and Ag-Cu materials. Moreover, Khaoo et al [26] achieved an increase in photovoltaic performance and external quantum efficiency for ZnO/Cu 2 O by rapid thermal annealing.…”
Section: Introductionmentioning
confidence: 99%
“…Compared to other methods, dewetting has the advantages of large area coverage, low cost and production of ordered NPs. Furthermore, the rapid thermal treatment of thin Ag/Cu bilayers also enables the production of composite Ag-Cu nanoparticles [22]. However, the high melting temperatures of most metals are not easily achievable using conventional heating methods.…”
Section: Introductionmentioning
confidence: 99%
“…Dewetting is normally considered detrimental as it limits the thermal stability of films [5]. There are also applications, primarily to synthesize nanoparticle arrays by dewetting, with or without patterning [6][7][8][9][10][11][12][13][14][15]. Recently, we had reported on the synthesis of Cu-Ag bimetallic nanoparticles, by solid-state dewetting, which were used as etch masks to fabricate dual-diameter silica nanopillars for antireflection coating applications.…”
Section: Introductionmentioning
confidence: 99%