2023
DOI: 10.1021/acs.jpcc.3c00420
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Role of Postdeposition Annealing and Doping with Si and Al Impurities in the Formation of HfxSi1–xO2 at the SiO2/FE:HfO2 Interface in a Ferroelectric Field-Effect Transistor

Abstract: Characterization of the composition and extension of the SiO2/HfO2 interface in the model systems Si-sub./SiO2 (7.5 nm)/FE:HfO2 (9.5 nm)/TiN (9 nm) for standard impurity concentrations and annealing temperatures (Si 3.6%, 1000 °C; Al 5.5%, 850 °C) were carried out using X-ray photoelectron spectroscopy with high kinetic energies. In addition, the crystalline properties of HfO2 were characterized by transmission electron microscopy and grazing incidence X-ray diffraction depending on the type of impurity. Forma… Show more

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“…The annealing time directly affects the HfO 2 crystallization degree [31]. The annealing temperature affects the diffusion degree of the atoms [32] and oxygen vacancy content [33], which is related to the trapped charge [34]. Zhang et al found that with increasing annealing temperature, the interface charge increases at first and then decreases [35], while some other studies reported that the point defect and fixed charge decrease with the increasing annealing temperature [36].…”
Section: Introductionmentioning
confidence: 99%
“…The annealing time directly affects the HfO 2 crystallization degree [31]. The annealing temperature affects the diffusion degree of the atoms [32] and oxygen vacancy content [33], which is related to the trapped charge [34]. Zhang et al found that with increasing annealing temperature, the interface charge increases at first and then decreases [35], while some other studies reported that the point defect and fixed charge decrease with the increasing annealing temperature [36].…”
Section: Introductionmentioning
confidence: 99%