Role of oxide thickening in fatigue crack initiation in LIGA nickel MEMS thin films

Shan, Wenchao; Yang, Yong; Hillie, K.T.; Jordaan, W.A.; Soboyejo, Winston O.

doi:10.1016/j.msea.2012.10.057

Cited by 8 publications

(3 citation statements)

References 19 publications

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“…Such tools offer potential for validation of grain scale crystal plasticity models, as well as FIPs that correlate with fatigue crack formation and early growth. In addition, a large number of observations of formation and growth of fatigue cracks from free surfaces have been possible using in situ loading stages [114] with microscale specimens and MEMS devices [115,116]. Techniques such as high energy X-ray diffraction microscopy (HEDM), X-ray diffraction contrast tomography (DCT), also known as micro-CT (lCT) [117,118], and synchrotron X-ray methods [119] can provide more information to validate 3D MSC models for growth in the initial set of surrounding grains.…”

Section: Microstructurally Small Fatigue Crack Growth Beyond the Firsmentioning

confidence: 99%

Failure of metals II: Fatigue

Pineau¹,

McDowell²,

Busso³

et al. 2016

Acta Materialia

240

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Section: Microstructurally Small Fatigue Crack Growth Beyond the Firsmentioning

confidence: 99%

Failure of metals II: Fatigue

Pineau¹,

McDowell²,

Busso³

et al. 2016

Acta Materialia

240

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“…Highly detailed observations of formation and growth of fatigue cracks from free surfaces are facilitated using in situ loading stages [11] with microscale specimens and MEMS devices [12,13]. These techniques have characterized early stage fatigue damage at the micron scale arising from grain-to-grain incompatibility, as well as degradation of coatings and oxides.…”

Section: Plastic Strain Localization and Fatigue Crack Formationmentioning

confidence: 99%

Recent Developments in Assessing Microstructure-Sensitive Early Stage Fatigue of Polycrystals (Postprint)

Musinski¹

2014

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“…These devices are expected to be used in microwave communication, aerospace, weapon equipment, and other fields. [ 1–5 ]…”

Section: Introductionmentioning

confidence: 99%

Corrosion behavior of the nickel/nickel interface during the copper‐sacrificial layer release process in micro‐electroforming

Wang

et al. 2022

Materials & Corrosion

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This study investigates the corrosion behavior of the nickel/nickel (Ni/Ni) interface during the release of the copper-sacrificial layer in multilayered micro-electroforming. By altering the pre-and posttreatment of multilayered micro-electroforming (degreasing, in situ anodic treatment, pickling, repassivation, and heat treatment), six different types of Ni/Ni interfaces were obtained. The activities and surface characteristics of the pretreated Ni substrates were investigated via open circuit potential and X-ray photoelectron spectroscopy. The microstructures of the as-prepared Ni/Ni interfaces were determined using scanning electron microscopy; after releasing the sacrificial layer in the ferric chloride solution, their corrosion morphologies and corrosion depths were observed under a three-dimensional microscope with an ultra-depth of field. The Ni/Ni interface showed a pre-existing passive layer and interfacial defects. The interface was more prone to attack than the Ni base. Pitting corrosion along the interface boundary occurs via three main processes-initiation, growth, and pit coalescence-with a corresponding reduction in the interfacial adhesion strength and ultimately the structural integrity. The combination of substrate modification (degreasing and pickling) and heat posttreatment effectively avoids localized corrosion. We believe that the surface activation and thermally induced diffusion have worked.

show abstract

Role of oxide thickening in fatigue crack initiation in LIGA nickel MEMS thin films

Cited by 8 publications

References 19 publications

Failure of metals II: Fatigue

Failure of metals II: Fatigue

Recent Developments in Assessing Microstructure-Sensitive Early Stage Fatigue of Polycrystals (Postprint)

Corrosion behavior of the nickel/nickel interface during the copper‐sacrificial layer release process in micro‐electroforming

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