“…verified by author and et al This holds in particular for the cases of surface-breaking and subsurface tin inclusions embedded in a copper specimen [2,4]. Also, it was pointed out in [2,4,6,7] that the detectability of small inclusions and subtle imperfections by the non-contacting thermoelectric method is limited by the adverse background (intrinsic thermoelectric anisotropy) of the material to be inspected. This intrinsic background signal in thermoelectric measurements is due to macrostructural features such as texture induced anisotropy, residual stress, cold work, heat treatment, etc.…”