Rogowski current sensor design and analysis based on printed circuit boards (PCB)

Wang, Ruxi; Prabhakaran, S.; Burdick, W.E.; Nicholas, Raymond

doi:10.1109/ecce.2014.6953836

Cited by 7 publications

(3 citation statements)

References 6 publications

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“…The winding for this type of Rogowski coil is again formed by conductive traces and vias [17], but instead of a rigid PCB, it is printed on a flexible PCB [18], which hence constitutes a flexible skeleton. The printed winding is however rigid, since it cannot move with respect to the skeleton, even though the resulting PCB Rogowski coil is overall flexible.…”

Section: ) Rigid Winding On Flexible Skeletonmentioning

confidence: 99%

A Review of Traditional Helical to Recent Miniaturized Printed Circuit Board Rogowski Coils for Power-Electronic Applications

Shi

Xin

Loh

et al. 2020

IEEE Trans. Power Electron.

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Latest wide-bandgap power devices are switching progressively faster compared with existing silicon devices. Their accurate current measurements for either control or protection have therefore become tougher. One method, that can fulfill the requirements, is to use a Rogowski coil and its accompanied electronics to form a Rogowski current sensor with high bandwidth, small volume, low cost and ease of integration. This paper therefore aims to review various aspects of the Rogowski current sensor from its history, measuring principles to modern power-electronic applications. The applications have, in turn, motivated a progression from traditional helical to recent miniaturized printed-circuit-board (PCB) implementation, in order to improve the overall power density. This progression has similarly been reviewed, together with its various design aspects applied to the winding, integrator, shielding, and parameters of the Rogowski current sensor. Future challenges and directions are then summarized, whose ultimate goal is to maximize accuracy over a wide bandwidth without being affected by radiated and near-field-coupling interferences.

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Section: ) Rigid Winding On Flexible Skeletonmentioning

confidence: 99%

A Review of Traditional Helical to Recent Miniaturized Printed Circuit Board Rogowski Coils for Power-Electronic Applications

Shi

Xin

Loh

et al. 2020

IEEE Trans. Power Electron.

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“…Finally, the PCB air-core coil sensor is fabricated by calculating the coil parameters [ 23 ]. The impedance of the sensor coil itself is measured by using Agilent 4294A (Agilent Technologies Inc., Santa Clara, CA, USA), as shown in Figure 12 .…”

Section: Design Of the Current Transformermentioning

confidence: 99%

Design and Experimental Study of a Current Transformer with a Stacked PCB Based on B-Dot

Wang

Tian

et al. 2017

Sensors

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An electronic current transformer with a B-dot sensor is proposed in this study. The B-dot sensor can realize the current measurement of the transmission line in a non-contact way in accordance with the principle of magnetic field coupling. The multiple electrodes series-opposing structure is applied together with differential input structures and active integrating circuits, which can allow the sensor to operate in differential mode. Maxwell software is adopted to model and simulate the sensor. Optimization of the sensor structural parameters is conducted through finite-element simulation. A test platform is built to conduct the steady-state characteristic, on-off operation, and linearity tests for the designed current transformer under the power-frequency current. As shown by the test results, in contrast with traditional electromagnetic CT, the designed current transformer can achieve high accuracy and good phase-frequency; its linearity is also very good at different distances from the wire. The proposed current transformer provides a new method for electricity larceny prevention and on-line monitoring of the power grid in an electric system, thereby satisfying the development demands of the smart power grid.

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“…The flexible and lightweight feature of flexible printed circuit board (FPCB) has gained interest from electronic and microelectronic industries (Xiao et al, 2008). FPCB has been used in several applications, for instance FPCB is used as the flexible base of the temperature sensor array, flow sensor and light weight light-emitting diode, and FPCB replaced rigid printed circuit board (RPCB) as computer motherboard, wire wound coil, winding motor and electrodynamics bearings (Leong, 2014;Petropoulos et al, 2012;Takamatsu et al, 2015;Leong et al, 2013;Wang et al, 2014;Dehez et al, 2014;Guoping et al, 2015). Unfortunately, the flexibility of FPCB also causes it to encounter undesirable deformation under flow environment with heat effects.…”

Section: Introductionmentioning

confidence: 99%

Heat transfer and deformation analysis of flexible printed circuit board under thermal and flow effects

Lim

Abdullah

Azid

et al. 2020

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Purpose The purpose of this study is to investigate heat transfer and deformation of flexible printed circuit board (FPCB) under thermal and flow effects by using fluid structure interaction. This study simulate the electronic cooling process when electronic devices are generating heat during operation at FPCB under force convection. Design/methodology/approach The thermal and flow effects on FPCB with attached ball grid array (BGA) packages have been investigated in the simulation. Effects of Reynolds number (Re), number of BGA packages attached, power supplied to the BGA packages and size of FPCB were studied. The responses in the present study are the deflection/length of FPCB (δ/L) and Nusselt number (Nu). Findings It is important to consider both thermal and flow effects at the same time for understanding the characteristic of FPCB attached with BGA under operating condition. Empirical correlation equations of Re, Prandtl number (Pr), δ/L and Nu have been established, in which the highest effect is of Re, followed by Pr and δ/L. The δ/L and Nu¯ were found to be significantly affected by most of the parametric factors. Practical implications This study provides a better understanding of the process control in FPCB assembly. Originality/value This study provides fundamental guidelines and references for the thermal coupling modelling to address reliability issues in FPCB design. It also increases the understanding of FPCB and BGA joint issues to achieve high reliability in microelectronic design.

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Rogowski current sensor design and analysis based on printed circuit boards (PCB)

Cited by 7 publications

References 6 publications

A Review of Traditional Helical to Recent Miniaturized Printed Circuit Board Rogowski Coils for Power-Electronic Applications

A Review of Traditional Helical to Recent Miniaturized Printed Circuit Board Rogowski Coils for Power-Electronic Applications

Design and Experimental Study of a Current Transformer with a Stacked PCB Based on B-Dot

Heat transfer and deformation analysis of flexible printed circuit board under thermal and flow effects

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