An
economical and efficient strategy for fabricating high-performance
metallic copper layers on polyphenylene sulfide (PPS) for high-frequency
microwave applications via mussel-inspired surface modification and
electroless copper plating (ECP) is illustrated in this paper. Through
UV-induced surface modification of catechol (CA)/polyamine (PA), the
modified PPS substrate is capable of adsorbing silver particles, which
provides activation sites for subsequent ECP. The impact of CA/PA
modification on the relationship between PPS and the deposited copper
layer can be determined by water contact angle measurements, X-ray
photoelectron spectroscopy (XPS), X-ray diffraction (XRD), and tape
peel tests. The involvement of CA/PA has successfully introduced the
functional groups for chemical bonding on the PPS surface, which greatly
improves the adhesion between the PPS and the deposited copper layer.
Moreover, after 40 min of ECP, the produced copper layer exhibits
good adhesion at the 5B level (according to the ASTM D3559) and an
excellent conductivity of 0.37 S/m (approx. 62% of bulk copper). Meanwhile,
the deposited copper layer also has good resistance to acid, alkali,
and salt corrosion (less than 25 g/m2 per unit area weight
loss after 60 h of corrosion). This approach opens up an efficient
path for the surface metallization of PPS, which has a broad potential
for application in high-frequency copper-clad laminates (CCLs).