Robust Design Analysis on Fatigue Life of Lead-Free Sn0.5Ag Solder in a Multichip Module Package

Kung, Chieh

doi:10.4028/www.scientific.net/amm.284-287.375

Cited by 4 publications

(4 citation statements)

References 8 publications

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“…Chowdhury et al [5] utilized orthogonal experimental design to analyze the main factors causing variations in lead-free processes and optimized the solder wetting with the goal of achieving the best combination of strength through thermal cycling verification. Kung Chieh et al [6] employed orthogonal experimental design to perform robust design analysis on the thermalmechanical reliability of MCM (multi-chip module) packaging with flip-chip technology. They identified the substrate's CTE (coefficient of thermal expansion) as the most significant factor influencing the reliability of coating fatigue and obtained the optimal combination parameters, resulting in a 554.5% increase in fatigue life under the best combination parameters.…”

Section: Introductionmentioning

confidence: 99%

Optimization Method for Hot Air Reflow Soldering Process Based on Robust Design

Ran,

Chen,

Chen

et al. 2023

Processes

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The process design of hot air reflow soldering is one of the key factors affecting the quality of PCBA (Printed Circuit Board Assembly) component products. In order to improve the product quality during the design process, this paper proposes a robust optimization-based finite element simulation analysis method including significant influencing factor screening, robustness evaluation, robust optimization, and reliability verification for the reflow soldering process. The simulation model of the reflow soldering process temperature field based on experiments is constructed and validated. Sensitivity analysis is used to select important influencing factors, such as the last five set temperature zones (T5 to T9) in the reflow oven and the thermal properties of materials such as PCBs (printed circuit boards), BGAs (ball grid arrays), and solder paste, as well as noise factors like the heating environment during the soldering process. Several surrogate models are used to construct the response surface, and the optimal fitting scheme is selected to effectively avoid poor fitting caused by inappropriate surrogate models. The 6σ robust optimization approach is introduced to evaluate and optimize the robustness of the process design parameter where the heating factor is chosen as the optimization target. The reliability analysis method is employed to validate the product quality. This paper establishes a comprehensive robustness analysis method for hot air reflow soldering, effectively reducing design costs and addressing the lack of robustness analysis in the current hot air reflow soldering process design.

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Section: Introductionmentioning

confidence: 99%

Optimization Method for Hot Air Reflow Soldering Process Based on Robust Design

Ran,

Chen,

Chen

et al. 2023

Processes

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“…The quality of wire bonding adhesion is very important as it affects its quality and electrical performances [1]. As the world of semiconductor technology is moving to greater miniaturization, the quality of bondability has great significance and determines its reliability [2]. Optimization of process or bonding, surface roughness is a critical parameter for bond adhesion of the wire to the metallization pad.…”

Section: Introductionmentioning

confidence: 99%

Surface Roughness and Wettability Correlation on Etched Platinum Using Reactive Ion Ecthing

Sauli

Retnasamy

Yeow

et al. 2014

AMM

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As the world of semiconductor is moving towards smaller and high-end applications, the quality of the bonding adhesion for wire bonding is very critical. Although aluminium has been the metallization of choice in integrated circuits, it can be easily oxidized during high temperature and pressure. On the other hand, Platinum metallization layer has high thermal coefficient resistance and inert to oxygen. This paper reports the correlation between surface roughness and the wettability in the form of contact angle for Platinum deposited wafer etched using Inductively Couple Plasma-Reactive Ion Etching (ICP-RIE). Surface roughness was measured using AFM while contact angle was obtained via droplet test. The results clearly suggested that both surface roughness and wettabily, calculated by its contact angle value has the same trend. Surface roughness is directly proportional to the contact angle. This indicates that surface roughness have great influence on the surface wettability. Therefore, the adhesion for wire bonding process on platinum metallization which can be used in high end applications can be controlled by its surface roughness and wettability.

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“…As flip chip technology is moving to greater miniaturization, the quality of the under bump metallization (UBM) has great significance and determines its reliability [1][2][3]. Generally, what influences the semiconductor manufacturing thoroughly is the optimization of process or product quality [3].…”

Section: Introductionmentioning

confidence: 99%

Quantitative Bump Height Analysis in ENIG Using Design of Experiment

Sauli

Retnasamy

Ehkan

et al. 2014

AMR

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Flip chip technology has grown by leaps and bounds and is getting even smaller in size. Optimization of process parameters in manufacturing is eminent due to reliability issues. This paper reports the parameters that affect the quality of the bump height in electroless nickel immersion gold (ENIG) and their relationships between each other. A total of four different combinations of parameters have been carried out for this investigation using the design of experiment (DOE) approach. It can be concluded that higher temperature of electroless nickel permits an increase of bump height where as the increment in immersion gold temperature does not nessasarily affect the value of bump height. All four samples recorded a higher value of bump height than the controlled bump height value. This implies reliability of the solder joint and assembly process robustness can be improved with an increase of bump height by increasing the time.

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Robust Design Analysis on Fatigue Life of Lead-Free Sn0.5Ag Solder in a Multichip Module Package

Cited by 4 publications

References 8 publications

Optimization Method for Hot Air Reflow Soldering Process Based on Robust Design

Optimization Method for Hot Air Reflow Soldering Process Based on Robust Design

Surface Roughness and Wettability Correlation on Etched Platinum Using Reactive Ion Ecthing

Quantitative Bump Height Analysis in ENIG Using Design of Experiment

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