Robust and Transparent Antifogging Polysilsesquioxane Film Containing a Hydroxy Group

Hamada, Takashi; Sugimoto, Tetsuya; Maeda, Tetsuya; Katsura, Daiji; Mineoi, Susumu; Ohshita, Joji

doi:10.1021/acs.langmuir.2c00438

Cited by 8 publications

(28 citation statements)

References 47 publications

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“…Water was purified using a Millipore Mill-Q UV system. The glass substrates were washed using an alkaline solution according to our previous study . A Kapton film (thickness, 12.5 μm) was purchased from AZ One Corporation (Osaka, Japan).…”

Section: Methodsmentioning

confidence: 99%

“…PSQ-Diol/EG films were prepared according to a reported procedure . First, a 50 wt % PSQ-Gly/EG–THF solution was coated onto a cleaned glass substrate using an applicator (clearance gap of 50 μm) and heated at 80 and 150 °C for 1 and 0.5 h, respectively.…”

Section: Methodsmentioning

confidence: 99%

“…Fourier transform infrared (FT-IR) spectroscopy was performed using a Shimadzu IRAffinity-1 spectrometer on a sample-coated silicon wafer in transmittance mode. To measure the WU of the PSQ-Diol/EG film, a PSQ-Diol/EG film was prepared on the Kapton film, and the PSQ-Diol/EG-coated Kapton film was placed in a temperature and relative humidity (RH)-controlled chamber and weighed after exposure to 20 or 95% RH at 30 °C for 2 h. The detailed calculation for WU is described in our previous study . Indentation and scratch tests were performed to evaluate the elastic modulus and scratch resistance of the PSQ-Diol/EG film, respectively, using a Nano Indenter G200.…”

Section: Methodsmentioning

confidence: 99%

“…Indentation and scratch tests were performed to evaluate the elastic modulus and scratch resistance of the PSQ-Diol/EG film, respectively, using a Nano Indenter G200. The detailed procedure is available in our previous paper. , …”

Section: Methodsmentioning

confidence: 99%

“…The characteristic feature of POSS and PSQ is that the inorganic Si–O–Si bonds and organic functional groups on the Si atom provide high mechanical and thermal stability and the desired function, respectively. − Antifogging materials based on POSS polyamide exhibit high scratch resistance because of the crosslinked structure and the rigidity of the POSS structure . Similarly, we reported antifogging materials based on PSQ, including poly[3-(2-aminoethylaminopropyl)]silsesquioxane (PAEAPS) and poly[3-(2,3-dihydroxypropoxypropyl)]silsesquioxane (PSQ-OH). , For example, the PSQ-OH film exhibited a high scratch resistance of 2.7–3.6 determined by nanoindentation experiments, which was 5–7 times higher than that of the PVA film. The nanoindenter test revealed that the siloxane network in PSQ-OH afforded a high scratch resistance originating from the elastic recovery from deformation.…”

Section: Introductionmentioning

confidence: 95%

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Highly Durable Antifogging Materials Based on Polysilsesquioxane with Double Hydrophilic Groups: Effect of Bridged Tetraethylene Glycol Chains in Polysilsesquioxane Films

Maeda

Sugimoto

Hamada

et al. 2022

ACS Appl. Polym. Mater.

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To investigate the effect of introducing a hydrophilic and flexible tetraethylene glycol chain into a polysilsesquioxane (PSQ) antifogging film, a poly[3-(2,3-dihydroxypropoxypropyl)-co-tetraethylene glycol]silsesquioxane (PSQ-Diol/EG) film was prepared via the sol−gel reaction of 3-glycidyloxypropyltrimethoxy s i l a n e ( G P T M S ) a n d t e t r a e t h y l e n e g l y c o l b i s -(triethoxysilylpropyl)ether (BTESP-EG). Their antifogging property, mechanical property, and durability were investigated. First, poly(glycidyloxypropyl-co-tetraethylene glycol)silsesquioxane (PSQ-Gly/EG) was synthesized via the sol−gel reaction of GPTMS and BTESP-EG. Thereafter, to prepare the PSQ-Diol/ EG film, PSQ-Gly/EG was coated onto a glass substrate, and the ring-opening reaction of epoxy groups was conducted by immersing the film in a 0.5 mol/L H 2 SO 4 solution. The PSQ-Diol/EG films exhibited a water uptake (WU) of 15−19%, similar to that of the poly[3-(2,3-dihydroxypropoxypropyl)]silsesquioxane (PSQ-OH) film (12−19%). The transparency of the PSQ-Diol/ EG film was maintained even after exposure to water vapor because of the absorption of water by the PSQ-Diol/EG film. The PSQ-Diol/EG film exhibited a high scratch resistance of 2.4−3.5 determined by nanoindentation, comparable to that of the PSQ-OH film (2.7−3.6). In the durability test, the WU of the PSQ-OH film slightly decreased during repetitive changes in the relative humidity (RH) between 95 and 20% at 30 °C, and cracks were formed on the surface after leaving the film to stand at a high RH of 95% at 50 °C. Contrarily, the PSQ-Diol/EG film did not exhibit a decrease in WU and crack formation on the surface under the same conditions. The introduction of hydrophilic and flexible tetraethylene glycol chains into the PSQ antifogging film was effective in improving the durability while maintaining the antifogging property and mechanical strength. The polycondensation reaction of residual silanol groups observed for the PSQ-OH film was probably suppressed in the PSQ-Diol/EG film because of the space effect of the tetraethylene glycol units keeping the silanol groups away from each other.

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Section: Methodsmentioning

confidence: 99%

Section: Methodsmentioning

confidence: 99%

Section: Methodsmentioning

confidence: 99%

Section: Methodsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 95%

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Highly Durable Antifogging Materials Based on Polysilsesquioxane with Double Hydrophilic Groups: Effect of Bridged Tetraethylene Glycol Chains in Polysilsesquioxane Films

Maeda

Sugimoto

Hamada

et al. 2022

ACS Appl. Polym. Mater.

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Influence of alkyl groups on the formation of softenable polysilsesquioxanes

Pohl

Kickelbick

2023

J Sol-Gel Sci Technol

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Polysilsesquioxanes (PSQ) containing phenyl groups as substituents on the silicon atom can form transparent, hard and glassy materials at room temperature, which reversibly soften when heated above the glass transition temperature. Further increase in temperature leads to irreversible curing. With this property, polyphenylsilsesquioxanes can be assigned to the so-called melting gels. In contrast to the aromatic systems, polysilsesquioxanes with alkyl groups belonging to this class of materials are not known. To identify structural differences between aryl and alkyl systems, polyalkylsilsesquioxanes (RPSQs with R = methyl, ethyl, propyl, hexyl, octyl, decyl, dodecyl, hexadecyl, and octadecyl) were synthesised by a solvent-free, acid-catalysed hydrolysis and condensation reaction of alkyltrimethoxysilanes followed by thermal treatment at 300 °C under N2 atmosphere. The influence of the alkyl chain length on the structure built and the thermally initiated further condensation reactions were investigated via NMR, FTIR, TGA, DSC, SEC, and XRD. Depending on the alkyl chain length, the formation of highly crosslinked, insoluble systems (Me-PrPSQ), low molecular weight oligosilsesquioxanes in the form of cages (Hex-DecPSQ) to semicrystalline, lamellar layers (Dodec-OctadecPSQ) were detected. A low degree of condensation, inhibition of self-assembly and preferentially intermolecular condensation reactions were found to be crucial factors in the melting gel formation. Graphical Abstract

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Direct coating of transparent and wear-resistant polysilsesquioxane on ultra-thin glass for flexible cover windows

Kim,

Jeong

2024

Progress in Organic Coatings

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Robust and Transparent Antifogging Polysilsesquioxane Film Containing a Hydroxy Group

Cited by 8 publications

References 47 publications

Highly Durable Antifogging Materials Based on Polysilsesquioxane with Double Hydrophilic Groups: Effect of Bridged Tetraethylene Glycol Chains in Polysilsesquioxane Films

Highly Durable Antifogging Materials Based on Polysilsesquioxane with Double Hydrophilic Groups: Effect of Bridged Tetraethylene Glycol Chains in Polysilsesquioxane Films

Influence of alkyl groups on the formation of softenable polysilsesquioxanes

Direct coating of transparent and wear-resistant polysilsesquioxane on ultra-thin glass for flexible cover windows

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