2004
DOI: 10.1108/01445150410698958
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Robotic assembly and joining of miniature and MEMS components using adhesive films – test environment and experiences

Abstract: Currently, adhesive films are replacing glue in many applications in semiconductor packaging and microelectronic assembly. When adhesive films are used to mount components on a PCB, the success of the automatic joining operation depends on many different things. Manufacturers of adhesives use three main values when they are discussing processing parameters in their data sheets. The paper describes in detail the concept of the developed assembly environment for making test joints of miniature and MEMS component… Show more

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“…Many of these applications have arisen with the growth of the microelectromechanical systems (MEMS) (Ghayesh et al, 2013) market, such as microassembly, which can be defined as the assembly of micro-products, where the main goal is the construction of a micro-structure by means of several microcomponents under microscopic tolerances (Tarazon, 2010). Some good examples of micro-assembly of MEMS can be found in Dechev et al (2003) and Karjalainen et al (2004). The interaction between objects and final accuracy are the main issues in micro-assembly.…”
Section: Introductionmentioning
confidence: 99%
“…Many of these applications have arisen with the growth of the microelectromechanical systems (MEMS) (Ghayesh et al, 2013) market, such as microassembly, which can be defined as the assembly of micro-products, where the main goal is the construction of a micro-structure by means of several microcomponents under microscopic tolerances (Tarazon, 2010). Some good examples of micro-assembly of MEMS can be found in Dechev et al (2003) and Karjalainen et al (2004). The interaction between objects and final accuracy are the main issues in micro-assembly.…”
Section: Introductionmentioning
confidence: 99%