2007
DOI: 10.1149/1.2405724
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RIE of GaSb with an ECR Source Using Methane/Hydrogen Chemistry in an Argon Plasma

Abstract: Reactive ion etching ͑RIE͒ of GaSb samples was investigated under electron cyclotron resonance ͑ECR͒ conditions using CH 4 /H 2 /Ar gas mixtures. Different etching parameters ͓e.g., microwave and radio-frequency ͑rf͒ power levels, gas ratios, chamber pressure, etc.͔ were systematically varied to observe their effects on the etch characteristics. For microwave powers up to ϳ200 W the etch rate was found to increase with increasing microwave power. Above 200 W the etch rate appears to saturate for lower rf power… Show more

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Cited by 5 publications
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“…16. Mesas of about 4 m height were etched by reactive ion etching in a methane/argon/hydrogen dry plasma environment.…”
Section: Device Fabricationmentioning
confidence: 99%
“…16. Mesas of about 4 m height were etched by reactive ion etching in a methane/argon/hydrogen dry plasma environment.…”
Section: Device Fabricationmentioning
confidence: 99%