Soy-based
adhesives are environmentally friendly alternatives to
the harmful formaldehyde-based resins in manufacturing wood-based
panels. However, almost all of the modification methods use large
amounts of additives that negatively impact the environment. Therefore,
using a low-dosage cross-linker to improve both adhesive bond performance
and toughness remains a challenge in soy-based adhesive modification,
thereby limiting its applicability. Inspired by the microphase-separated
structure giving spider silk high toughness and performance, TEMPO-oxidized
cellulose nanofibers (TOCNFs, hard phase) were grafted by the hydroxymethyl
melamine prepolymer (HMP, enhance the TOCNFs/SF interface) to form
HTs, and then mixed with soy flour (SF, soft phase) to develop a novel
soy protein-based adhesive. This microphase structure effectively
improved the toughness of the soy-based adhesive, while the HTs reacted
with SF to form a cross-linked structure, which enhanced the water
resistance of the soy-based adhesive and hindered the formation and
expansion of cracks during the breaking process. The results show
that by using only 0.7% HTs in the adhesive formulation, the dry and
wet shear strengths of the resultant plywood increase by 117 and 322%,
respectively, while wood failure reaches 90%, which satisfies the
requirements for interior plywood use. Thus, using a low-dosage (72–94%
lower compared to those in the literature) nanomaterial to build a
microphase-separated structure in a soy-based adhesive is a promising
means for plywood production.