2015
DOI: 10.1134/s1560090415050103
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Rheokinetics of the curing of epoxy oligomer ED-20 modified with epoxy phosphazenes

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Cited by 11 publications
(3 citation statements)
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“…This work is the first one that revealed study of hot curing process of epoxy-amine binder with epoxyphosphazene represented in Figure 1 . However, there are related works [ 10 , 29 ] published by our research group. They were dedicated to the cold curing process of epoxy-amine binder with epoxyphosphazene of that type.…”
Section: Resultsmentioning
confidence: 99%
“…This work is the first one that revealed study of hot curing process of epoxy-amine binder with epoxyphosphazene represented in Figure 1 . However, there are related works [ 10 , 29 ] published by our research group. They were dedicated to the cold curing process of epoxy-amine binder with epoxyphosphazene of that type.…”
Section: Resultsmentioning
confidence: 99%
“…Figure 6. The TGA curves of the PCEO + MTHPA system cured at 140°C (1) and of the ED-20 + MTHPA system cured at 120°C (2)…”
Section: From the Rheokinetic Curves Inmentioning
confidence: 99%
“…Ongoing investigations into the properties of such oligomers [2,3], in this work a PCEO obtained by the method described earlier [1] and containing 40 wt% epoxyphosphazene and 60 wt% normal epoxy oligomer of type ED-20 formed simultaneously with it was investigated. The initial PCEO had an epoxy number of 16.9 and according to gel permeation chromatography (GPC) data contained a low-molecular-weight fraction with M n = 520 and a high-molecularweight epoxyphosphazene fraction with M n = 2400.…”
mentioning
confidence: 99%