2015 IEEE MTT-S International Microwave and RF Conference (IMaRC) 2015
DOI: 10.1109/imarc.2015.7411409
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RF multi-function chip at Ku-band

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Cited by 3 publications
(2 citation statements)
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“…The most diffused solutions are proposed for sub-GHz connections and for the spectrum portion from 2.4 GHz to 2.5 GHz where several standards operate: BT/BLE, ZigBee, Wi-Fi according to IEEE 802.11 b/g/n. Multi-standard chip are also available [6]. Most of these devices are designed to sustain a consumer temperature range (85 0 C maximum) and for cost reasons they feature a plastic package, e.g.…”
Section: Wireless Connection Capability Of Internet-on-chip Cots Devicesmentioning
confidence: 99%
“…The most diffused solutions are proposed for sub-GHz connections and for the spectrum portion from 2.4 GHz to 2.5 GHz where several standards operate: BT/BLE, ZigBee, Wi-Fi according to IEEE 802.11 b/g/n. Multi-standard chip are also available [6]. Most of these devices are designed to sustain a consumer temperature range (85 0 C maximum) and for cost reasons they feature a plastic package, e.g.…”
Section: Wireless Connection Capability Of Internet-on-chip Cots Devicesmentioning
confidence: 99%
“…Consequently, the size of T/R modules can be considerably reduced [1]. Moreover, the reliability of T/R modules is also enhanced due to the simplicity of the RF interconnection structures [2].…”
Section: Introductionmentioning
confidence: 99%