Microelectronics Reliability
 2024
DOI: 10.1016/j.microrel.2024.115496
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Revisiting the effectiveness of diamond heat spreaders on multi-finger gate GaN HEMT using chip-to-package-level thermal simulation

Amir Murtadha Mohamad Yussof,
Mohd Faizol Abdullah,
Muhammad Nur Affendy Muhammad Ridzwan
et al.
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