Review on three-dimensional ceramic filler networking composites for thermal conductive applications

Yoon, Hyungsub; Matteini, Paolo; Hwang, Byungil

doi:10.1016/j.jnoncrysol.2021.121272

Cited by 29 publications

(11 citation statements)

References 139 publications

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“…3. Good heat dissipation has been found to be essential in retarding the combustion of composites [27]. When certain part of the composites was overheated, that part of heat can be dissipated in time to avoid excessive accumulation of local heat, leading to the retardation of combustion.…”

Section: Thermal Conductivity Of the Bta/ep Compositesmentioning

confidence: 99%

Constructing integrated thermal conductive and flame-retardant filler network in ceramifiable epoxy composites

Kong,

Zhao,

Jiang

et al. 2023

Journal of Reinforced Plastics and Composites

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Simultaneously improving the thermal conductivity and flame resistance of epoxy composite is still a challenge. Herein, a novel epoxy composite with high thermal conductivity and greatly enhanced flame retardancy was developed through constructing integrated three-dimensional (3D) network based on boron nitride (BN), talc, ammonium polyphosphate (APP). The thermal conductivity of the composite with filler network reached 3.04 Wm−1K−1, which was 15.2 and 3.1 times of those of pure epoxy and sample with random filler distribution. The LOI value of the composite with filler network reached 37.8%, which was 1.9 and 1.4 times of those of pure epoxy and sample with random filler distribution, respectively. In addition, the effects of various combinations of filler on the flame resistance of the epoxy composite were also evaluated. The prepared composite with filler network exhibited excellent shape stability and mechanical strength even after ablation at 1000°C. The network structure constructed by BN had a positive effect on heat transfer, while APP led to the formation of phosphoric acid at high temperature, adhering to talc and other residues together. A ceramic-like residue was formed on the firing surface, which enhanced the barrier effect of char layer and flame resistance of the composite.

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Section: Thermal Conductivity Of the Bta/ep Compositesmentioning

confidence: 99%

Constructing integrated thermal conductive and flame-retardant filler network in ceramifiable epoxy composites

Kong,

Zhao,

Jiang

et al. 2023

Journal of Reinforced Plastics and Composites

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“…Significant research efforts have been dedicated to improving the TC of polymers, focusing especially on integrating inorganic fillers with organic resins to boost their TC. [2][3][4] The development of three-dimensional (3D) interconnected filler networks within a matrix has proven to be a productive strategy for enhancing the TC of composites. 5 The 3D filler skeleton has been preconstructed using various techniques, including icetemplate methods, 6,7 chemical vapor deposition (CVD), 8,9 sacrificial formwork method, [10][11][12] and cellulosesupported structure construction.…”

Section: Introductionmentioning

confidence: 99%

“…However, polymers' applications are significantly restricted by their poor thermal conductivity (TC). Significant research efforts have been dedicated to improving the TC of polymers, focusing especially on integrating inorganic fillers with organic resins to boost their TC 2–4 …”

Section: Introductionmentioning

confidence: 99%

Sugar‐template method to construct a boron nitride filler network to enhance the thermal conductivity of epoxy composites

Wang,

2024

J of Applied Polymer Sci

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In this work, a technique for constructing a three‐dimensional (3D) skeleton of hexagonal boron nitride (h‐BN) using sugar as the fulcrum and preparing composites by embedding in the epoxy (EP) in a vacuum environment is proposed. The study of thermal conductivity (TC) in polymer composites is conducted through a blend of techniques: laser flashing, theoretical modeling, and finite element simulation. The h‐BN skeleton exhibits a honeycomb structure through the scanning electron microscopy findings. Further investigation using finite element simulation demonstrates that conductive networks are formed by the h‐BN skeleton within the composites, leading to a notable enhancement in TC. Specifically, the composite for h‐BN/EP reaches a TC of 2.25 W/m K when composed of 52 vol% h‐BN. A dielectric loss of 0.008 for the composite with the same h‐BN loading shows a considerable improvement. The compressive yield strength of the 3D h‐BN/EP composites reached 312 MPa at 5 vol% h‐BN loading.

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“…These composites have infinite potential as functional materials for various industries, thereby motivating researchers. However, interestingly, only seven review articles related to conducting polymer in PU matrices have been published since 1993 [ 2 , 20 , 21 , 22 , 23 , 24 , 25 , 26 ]. Nevertheless, their steady research progress has been reported, which has brought about extended applications of PUs.…”

Section: Introductionmentioning

confidence: 99%

Revised Manuscript with Corrections: Polyurethane-Based Conductive Composites: From Synthesis to Applications

Choi¹,

Shin

et al. 2022

IJMS

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The purpose of this review article is to outline the extended applications of polyurethane (PU)-based nanocomposites incorporated with conductive polymeric particles as well as to condense an outline on the chemistry and fabrication of polyurethanes (PUs). Additionally, we discuss related research trends of PU-based conducting materials for EMI shielding, sensors, coating, films, and foams, in particular those from the past 10 years. PU is generally an electrical insulator and behaves as a dielectric material. The electrical conductivity of PU is imparted by the addition of metal nanoparticles, and increases with the enhancing aspect ratio and ordering in structure, as happens in the case of conducting polymer fibrils or reduced graphene oxide (rGO). Nanocomposites with good electrical conductivity exhibit noticeable changes based on the remarkable electric properties of nanomaterials such as graphene, RGO, and multi-walled carbon nanotubes (MWCNTs). Recently, conducting polymers, including PANI, PPY, PTh, and their derivatives, have been popularly engaged as incorporated fillers into PU substrates. This review also discusses additional challenges and future-oriented perspectives combined with here-and-now practicableness.

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Review on three-dimensional ceramic filler networking composites for thermal conductive applications

Cited by 29 publications

References 139 publications

Constructing integrated thermal conductive and flame-retardant filler network in ceramifiable epoxy composites

Constructing integrated thermal conductive and flame-retardant filler network in ceramifiable epoxy composites

Sugar‐template method to construct a boron nitride filler network to enhance the thermal conductivity of epoxy composites

Revised Manuscript with Corrections: Polyurethane-Based Conductive Composites: From Synthesis to Applications

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