2018
DOI: 10.1016/j.ijheatmasstransfer.2018.03.046
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Review of pool boiling enhancement with additives and nanofluids

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Cited by 158 publications
(26 citation statements)
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“…Review papers have intensively presented research studies that cover the preparation methods of various nanofluids and test their effect on CHF and HTC [ 321 , 355 , 356 , 357 , 358 , 359 ]. It was mentioned that carbon-based nanomaterials such as graphene dispersed in water enhanced the heat transfer as compared to any other nanoparticle [ 355 ].…”
Section: Thermal Applicationsmentioning
confidence: 99%
“…Review papers have intensively presented research studies that cover the preparation methods of various nanofluids and test their effect on CHF and HTC [ 321 , 355 , 356 , 357 , 358 , 359 ]. It was mentioned that carbon-based nanomaterials such as graphene dispersed in water enhanced the heat transfer as compared to any other nanoparticle [ 355 ].…”
Section: Thermal Applicationsmentioning
confidence: 99%
“…where t , nf , nf , and t are the turbulence viscosity, the viscosity of the nanofluid, the thermal diffusivity of the nanofluid, and the turbulence diffusivity, respectively. The turbulence viscosity and diffusivity are given by Equations (5), (6), and (7). 45 Using the Standard k − turbulent model, the equations for turbulent kinetic energy (k) and dissipation rate ( ) are given by Equation (8a) and (8b).…”
Section: Single-phase Modelmentioning
confidence: 99%
“…The thermal performance of common nanofluids such as Al 2 O 3 /H 2 O, TiO 3 /H 2 O, MgO 2 /H 2 O, Cu/H 2 O, Al/H 2 O, and CuO/EG among others have been investigated by various researchers and were found to have better convective heat transfer properties as compared to base fluids . However, in recent times, a new type of nanoparticle called carbon‐based nano structures (single‐walled nanotube, double walled nanotube, and multi‐walled nanotube) has attracted great attention due to their improved properties such as high thermal conductivity, large specific surface area, high aspect ratio, and low specific …”
Section: Introductionmentioning
confidence: 99%
“…Highly efficient cooling technologies have always been the subject of both scientific and engineering investigation in high-powered electronics circuits. Aiming to achieve highly efficient heat dissipation of high-heat-flux electronics, several advanced cooling technologies, including boiling cooling [1][2][3], liquid cooling [4,5], functional surface [6,7], microchannels heat sink [8][9][10], heat pipes [11][12][13], microfluidic engineering [14,15], metal foam [16], etc., have been introduced and applied in every field. Among these advanced cooling technologies, the heat pipes (such as grooved heat pipes [17], pulsation heat pipes [18], thermosyphons, etc.)…”
Section: Introductionmentioning
confidence: 99%