2019
DOI: 10.1002/adfm.201808567
|View full text |Cite
|
Sign up to set email alerts
|

Review of Polymer‐Based Nanodielectric Exploration and Film Scale‐Up for Advanced Capacitors

Abstract: The uprising demands for electrical power and electrification requires advanced dielectric functionalities including high capacitance density, high energy density, high current handling capability, high voltage, high temperature, high thermal conductivity, light weight, and environmental reliability. Nanodielectric engineering emerges and attracts extensive efforts from many countries as a result. Unlike prior reviews focusing on lab scale nanocomposite study, this review focuses on recent innovations in polym… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1

Citation Types

1
161
0
1

Year Published

2020
2020
2024
2024

Publication Types

Select...
6
4

Relationship

0
10

Authors

Journals

citations
Cited by 288 publications
(166 citation statements)
references
References 145 publications
1
161
0
1
Order By: Relevance
“…Moreover, the insulating nanostructures [14][15][16][17] are synthesized in low yields (e.g., nanosheets and nanowires), have high surface energies (i.e., unsatisfactory compatibility with polymers), and are loaded at high concentrations (c.a. 10 vol.%), rendering the manufacture of largearea and uniform nanocomposite films challenging 19 .…”
mentioning
confidence: 99%
“…Moreover, the insulating nanostructures [14][15][16][17] are synthesized in low yields (e.g., nanosheets and nanowires), have high surface energies (i.e., unsatisfactory compatibility with polymers), and are loaded at high concentrations (c.a. 10 vol.%), rendering the manufacture of largearea and uniform nanocomposite films challenging 19 .…”
mentioning
confidence: 99%
“…Because of the complex breakdown mechanism of dielectric polymers such as electronic breakdown and thermal breakdown, the theoretical E b is usually 10 times higher than experimental values of breakdown strength [120] and the (E b /10) values of typical insulating self-healing materials and conventional dielectric polymers are listed in Table 2 for comparison. [4,31,121,108,109,[122][123][124][125][126][127] For thin film dielectric polymers, stringent dielectric and thermal performance requirements in high-field and hightemperature applications leave limited material options. As shown in Table 2, except for some hydrogen bonding networks, the estimated breakdown strengths of most noncovalent intrinsic self-healing materials are much lower than those of the conventional dielectric polymers.…”
Section: Theoretical Considerations In Designing Self-healing Dielectmentioning
confidence: 99%
“…These capacitors find applications in numerous fields such as electronic circuits (filters/ rectifiers, coupling/decoupling, tuning, timing, and bypass), power electronics (commutation and snubbers), pulsed power applications (weapons: military, marine, aerospace, and explosives), medical devices, lighting (fluorescent lamps and discharge lamps) and automotive industries. 3,4 The commercially available biaxially oriented polypropylene (BOPP) capacitor showed a high breakdown strength of B6400 kV cm À1 , but it suffers from a low dielectric constant and hence low energy density (1-1.2 J cm À3 ). 5 Thus, there is an urgent need to develop low-cost and highly efficient dielectric capacitors to meet the next-generation energy requirements.…”
Section: Introductionmentioning
confidence: 99%