Review of Hybrid Packaging Methods for Power Modules
Puqi Ning,
Xiaoshuang Hui,
Yuhui Kang
et al.
Abstract:The hybrid structure of a power-module package is summarized and classified. Basic and extended planar wire-bond designs are analyzed and compared with regular wire-bond modules and planar modules, respectively. The automatic layout method can improve the electrical and thermal performance of hybrid structures. A state-of-the-art hybrid structure is introduced, and suggestions for alleviating the current and temperature imbalances for future designs are provided.
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