2021
DOI: 10.1149/2162-8777/ac040b
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Review—Emerging Applications of g-C3N4 Films in Perovskite-Based Solar Cells

Abstract: Graphitic carbon nitride, (g-CN/g-C3N4), an oldest material, was extensively used as photocatalyst due to high charge separation and transportation property, tunable band gap, and non-toxicity. Recently, g-CN has been utilized as an electron transport layer, interfacial buffer layer, and for passivation of perovskite layers in solar cell devices. Power conversion efficiency of g-CN-based solar cells has gone beyond 22.13% with device stability of more than 1500 h in dark. Additionally, the enhanced environment… Show more

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Cited by 12 publications
(13 citation statements)
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References 162 publications
(167 reference statements)
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“…Nevertheless, the open-air instability of perovskites is still a challenge restricting their commercialization. , To address the instability issue, encapsulation of perovskite nanocrystals (PNCs) and heterostructures formation have emerged as a preferred and easy approach. Accordingly, researchers have explored several encapsulators; for instance, many polymers and inorganic oxides were used to provide excellent stability to halide perovskites. Due to their insulating nature, these encapsulators hinder perovskite-based optoelectronic devices’ performance. Therefore, perovskite heterostructures’ formation with some fast charge transfer materials is the next possible way that will help in both ways (i.e., provide stability and quick charge extraction) for improved performance in optoelectronic devices.…”
Section: Introductionmentioning
confidence: 99%
“…Nevertheless, the open-air instability of perovskites is still a challenge restricting their commercialization. , To address the instability issue, encapsulation of perovskite nanocrystals (PNCs) and heterostructures formation have emerged as a preferred and easy approach. Accordingly, researchers have explored several encapsulators; for instance, many polymers and inorganic oxides were used to provide excellent stability to halide perovskites. Due to their insulating nature, these encapsulators hinder perovskite-based optoelectronic devices’ performance. Therefore, perovskite heterostructures’ formation with some fast charge transfer materials is the next possible way that will help in both ways (i.e., provide stability and quick charge extraction) for improved performance in optoelectronic devices.…”
Section: Introductionmentioning
confidence: 99%
“…Recently, a few strategies have been evolved to design more stable and efficient SCs using composites of two-dimensional (2D) carbonic materials with perovskite. 32 The photophysical properties could be enhanced by forming CsPbBr 3 heterostructures with π-conjugated 2D materials to ease the charge transportation. 33 Another major concern with CsPbBr 3 is instability, which can also be improved by forming CsPbBr 3 heterostructures with 2D materials along with HC dynamics.…”
Section: ■ Introductionmentioning
confidence: 99%
“…In this regard, the usage of g‐C 3 N 4 in PSCs is recently expanded due to its outstanding optical and electrical features 22,23 . The addition of g‐C 3 N 4 to the active absorbing perovskite and/or the electron transport layer (ETL) increases PCE by around 22.13% 24 . This is mainly due to the defect passivation, increased conductivity, crystallinity, and low charge carrier recombination inside the device 25‐27 .…”
Section: Introductionmentioning
confidence: 99%
“…22,23 The addition of g-C 3 N 4 to the active absorbing perovskite and/or the electron transport layer (ETL) increases PCE by around 22.13%. 24 This is mainly due to the defect passivation, increased conductivity, crystallinity, and low charge carrier recombination inside the device. [25][26][27] At the PSC interfaces, the wetting (hydrophobic/hydrophilic) character of g-C 3 N 4 and fine control of the interface energetic resulted in a significant performance improvement, including an increase in the stability 25,28,29 To change the electron-transport layer/ perovskite and perovskite/hole-transport layer interfaces, Liu et al 30 have recently used 2D g-C 3 N 4 , a heat-resistant n-type semiconductor.…”
Section: Introductionmentioning
confidence: 99%